JPS5466780A - Manufacture for semiconductor device - Google Patents

Manufacture for semiconductor device

Info

Publication number
JPS5466780A
JPS5466780A JP13369477A JP13369477A JPS5466780A JP S5466780 A JPS5466780 A JP S5466780A JP 13369477 A JP13369477 A JP 13369477A JP 13369477 A JP13369477 A JP 13369477A JP S5466780 A JPS5466780 A JP S5466780A
Authority
JP
Japan
Prior art keywords
layer
film
groove
coated
type gaas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13369477A
Other languages
Japanese (ja)
Other versions
JPS6129557B2 (en
Inventor
Toshio Usui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP13369477A priority Critical patent/JPS5466780A/en
Publication of JPS5466780A publication Critical patent/JPS5466780A/en
Publication of JPS6129557B2 publication Critical patent/JPS6129557B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Junction Field-Effect Transistors (AREA)

Abstract

PURPOSE:To obtain high frequency response through the short gate length, by growing epitaxial layer on the side wall of the V groove placed on the surface of semiconductor substrate and by forming the gate metal layer on the epitaxial layer through the use of the step difference of the window of the anti-step shape for the corss section formed on the V groove. CONSTITUTION:On the N<+> type GaAs substrate 1, the semi-insulation GaAs layer 2 and the N<+> type GaAs layer 3 are grown with lamination, and the lamination film of the SiO2 film 4 and the Si3N4 film 5 is coated on it. Next, the window 6 is opened on the film 5 and the under cut is caused on the film 4 with over etching, isotropic etching is made by taking the films 4 and 5 as masks, forming the V shaped groove 8 reaching the substate 1. After that, in the groove 8, N type GaAs layer 9 is grown epitaxially and the SiO2 film 10 of anti-step shape for the corss section is coated only at the bottom of the groove 8, and the Al gate metallic layer 11 is coated on it from a part of the epitaxial layer 9. Next, the gate electrode 16 is attached on it, the drain electrode is on the layer 3 and the source electrode is at the back of the substrate 1.
JP13369477A 1977-11-08 1977-11-08 Manufacture for semiconductor device Granted JPS5466780A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13369477A JPS5466780A (en) 1977-11-08 1977-11-08 Manufacture for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13369477A JPS5466780A (en) 1977-11-08 1977-11-08 Manufacture for semiconductor device

Publications (2)

Publication Number Publication Date
JPS5466780A true JPS5466780A (en) 1979-05-29
JPS6129557B2 JPS6129557B2 (en) 1986-07-07

Family

ID=15110683

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13369477A Granted JPS5466780A (en) 1977-11-08 1977-11-08 Manufacture for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5466780A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55120168A (en) * 1979-03-08 1980-09-16 Sony Corp Field effect type semiconductor device
JPS59969A (en) * 1982-06-25 1984-01-06 Nippon Telegr & Teleph Corp <Ntt> Field effect transistor
JP2003069041A (en) * 2001-08-29 2003-03-07 Denso Corp Silicon carbide semiconductor device and method of manufacturing the same
JP2003068761A (en) * 2001-08-29 2003-03-07 Denso Corp Silicon carbide semiconductor device and method of manufacturing the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55120168A (en) * 1979-03-08 1980-09-16 Sony Corp Field effect type semiconductor device
JPS59969A (en) * 1982-06-25 1984-01-06 Nippon Telegr & Teleph Corp <Ntt> Field effect transistor
JP2003069041A (en) * 2001-08-29 2003-03-07 Denso Corp Silicon carbide semiconductor device and method of manufacturing the same
JP2003068761A (en) * 2001-08-29 2003-03-07 Denso Corp Silicon carbide semiconductor device and method of manufacturing the same

Also Published As

Publication number Publication date
JPS6129557B2 (en) 1986-07-07

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