JPS5469068A - Semiconductor device and its manufacture - Google Patents

Semiconductor device and its manufacture

Info

Publication number
JPS5469068A
JPS5469068A JP13572077A JP13572077A JPS5469068A JP S5469068 A JPS5469068 A JP S5469068A JP 13572077 A JP13572077 A JP 13572077A JP 13572077 A JP13572077 A JP 13572077A JP S5469068 A JPS5469068 A JP S5469068A
Authority
JP
Japan
Prior art keywords
frame
sealing substance
tab
pellet
wax
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13572077A
Other languages
Japanese (ja)
Inventor
Eiji Oi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13572077A priority Critical patent/JPS5469068A/en
Publication of JPS5469068A publication Critical patent/JPS5469068A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H10W72/07504—Connecting or disconnecting of bond wires using an auxiliary member the auxiliary member being temporary, e.g. a sacrificial coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To form an ultra-miniature device by exposing the surface of plural external terminals of the metal plate on the lower surface of the sealing substance and connecting the other end to the element electrode within the sealing substance. CONSTITUTION:Lead frame 14 is sticked onto glass plate 12 via wax 13. In the frame, unit pattern 15 is formed into a matrix shape, and tab 18 and external terminal 19 are provided at the tip of tab lead 17. Pellet 20 is adhered on tab 18, and the electrode is connected (21) to external 11. Then the resin is sticked onto frame 14, and sealing substance 22 covers the pellet, wire and frame. Notch groove 23 is made to reach the glass layer. Then wax 13 is fused, and device 25 unified via sealing substance 22 is isolated from plate 12. In this way, an accurate assembling becomes possible, and thus a large-scale batch process can be carried out.
JP13572077A 1977-11-14 1977-11-14 Semiconductor device and its manufacture Pending JPS5469068A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13572077A JPS5469068A (en) 1977-11-14 1977-11-14 Semiconductor device and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13572077A JPS5469068A (en) 1977-11-14 1977-11-14 Semiconductor device and its manufacture

Publications (1)

Publication Number Publication Date
JPS5469068A true JPS5469068A (en) 1979-06-02

Family

ID=15158296

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13572077A Pending JPS5469068A (en) 1977-11-14 1977-11-14 Semiconductor device and its manufacture

Country Status (1)

Country Link
JP (1) JPS5469068A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5556647A (en) * 1978-10-19 1980-04-25 Cii Honeywell Bull Flat package for at least one integrated circuit device
US5832600A (en) * 1995-06-06 1998-11-10 Seiko Epson Corporation Method of mounting electronic parts
WO2002001634A3 (en) * 2000-06-27 2002-06-20 Infineon Technologies Ag System support for semiconductor chips and electronic components and method for producing a system support and electronic components
US9287476B2 (en) 2008-09-03 2016-03-15 Nichia Corporation Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5556647A (en) * 1978-10-19 1980-04-25 Cii Honeywell Bull Flat package for at least one integrated circuit device
US5832600A (en) * 1995-06-06 1998-11-10 Seiko Epson Corporation Method of mounting electronic parts
WO2002001634A3 (en) * 2000-06-27 2002-06-20 Infineon Technologies Ag System support for semiconductor chips and electronic components and method for producing a system support and electronic components
US6969905B2 (en) 2000-06-27 2005-11-29 Infineon Technologies Ag Leadframe for semiconductor chips and electronic devices and production methods for a leadframe and for electronic devices
US9287476B2 (en) 2008-09-03 2016-03-15 Nichia Corporation Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
US9490411B2 (en) 2008-09-03 2016-11-08 Nichia Corporation Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
US9537071B2 (en) 2008-09-03 2017-01-03 Nichia Corporation Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
US10115870B2 (en) 2008-09-03 2018-10-30 Nichia Corporation Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
US10573788B2 (en) 2008-09-03 2020-02-25 Nichia Corporation Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
US10573789B2 (en) 2008-09-03 2020-02-25 Nichia Corporation Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
US10700241B2 (en) 2008-09-03 2020-06-30 Nichia Corporation Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
US11094854B2 (en) 2008-09-03 2021-08-17 Nichia Corporation Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
US12211959B2 (en) 2008-09-03 2025-01-28 Nichia Corporation Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body

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