JPS5745964A - Manufacture of hybrid integrated circuit - Google Patents

Manufacture of hybrid integrated circuit

Info

Publication number
JPS5745964A
JPS5745964A JP55122052A JP12205280A JPS5745964A JP S5745964 A JPS5745964 A JP S5745964A JP 55122052 A JP55122052 A JP 55122052A JP 12205280 A JP12205280 A JP 12205280A JP S5745964 A JPS5745964 A JP S5745964A
Authority
JP
Japan
Prior art keywords
leads
frame
integrated circuit
hybrid integrated
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55122052A
Other languages
Japanese (ja)
Inventor
Eiji Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP55122052A priority Critical patent/JPS5745964A/en
Publication of JPS5745964A publication Critical patent/JPS5745964A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To reduce by half the connecting portions of a hybrid integrated circuit by forming leads for external terminal of a frame and connecting the leads for the external terminal directly to the electrodes of an IC substrate without using wires nor lead wires. CONSTITUTION:A frame 1 has leads 8 for external terminal, the leads 8 are pressed to be reduced in thickness, are then bent to be brought into the position of the respective electrodes 5 of an IC as a connecting part. The leads 8 are disposed at a frame 1 corresponding to the electrodes 5 of the IC. When the frame 1 is bonded at 3 to a substrate 2, the connecting part 10 of the leads 8 is positioned at the respective electrodes 5, and is thereafter soldered at 6 to complete it. With this configuration, the molten part is reduced by half from the conventional one, and an IC of inexpensive cost and high reliability can be obtained.
JP55122052A 1980-09-02 1980-09-02 Manufacture of hybrid integrated circuit Pending JPS5745964A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55122052A JPS5745964A (en) 1980-09-02 1980-09-02 Manufacture of hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55122052A JPS5745964A (en) 1980-09-02 1980-09-02 Manufacture of hybrid integrated circuit

Publications (1)

Publication Number Publication Date
JPS5745964A true JPS5745964A (en) 1982-03-16

Family

ID=14826417

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55122052A Pending JPS5745964A (en) 1980-09-02 1980-09-02 Manufacture of hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS5745964A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0077276A3 (en) * 1981-10-13 1986-03-26 FAIRCHILD CAMERA & INSTRUMENT CORPORATION Method for fabricating a hybrid circuit module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0077276A3 (en) * 1981-10-13 1986-03-26 FAIRCHILD CAMERA & INSTRUMENT CORPORATION Method for fabricating a hybrid circuit module

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