JPS6436055A - Method of sealing electronic component - Google Patents

Method of sealing electronic component

Info

Publication number
JPS6436055A
JPS6436055A JP62190464A JP19046487A JPS6436055A JP S6436055 A JPS6436055 A JP S6436055A JP 62190464 A JP62190464 A JP 62190464A JP 19046487 A JP19046487 A JP 19046487A JP S6436055 A JPS6436055 A JP S6436055A
Authority
JP
Japan
Prior art keywords
printed
printed frame
frame
sealing member
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62190464A
Other languages
Japanese (ja)
Inventor
Yutaka Okuaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP62190464A priority Critical patent/JPS6436055A/en
Publication of JPS6436055A publication Critical patent/JPS6436055A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To lower a 'rejecting' phenomenon and to improve filling performance, reliability, and working performance, by solidifying a printed frame which is B-staged beforehand on a printed substrate, and by mounting electronic components inside this printed frame and by leaving metallic thin wires connected and filling the printed frame with a sealing member to unite the printed frame with the sealing member. CONSTITUTION:A printed frame 15 is B-staged on a printed substrate by a method such as silk printing or, stamping, and it is solidified beforehand with resin in a prescribed shape at a normal temperature or at a temperature of 80 deg.C or so. Next a semiconductor element 11 is mounted on a printed substrate 12 inside this printed frame, and metallic wires 14 are used to connect guide electrodes with conductive terminals 13a of conductors 13. Next the printed frame 15 is filled with a sealing member 16 of resin. In this case the printed frame 15 is heated again at 80-150 deg.C to be softened to unite the printed frame 15 with the sealing member 16. Accordingly all corner parts of the peripheral surface of the semiconductor element 11 on the printed frame 15, as well as the sealing member, are filled thoroughly with resin, and so the semiconductor element 11 and the metallic thin wires 14 are sealed to improve filling efficiency.
JP62190464A 1987-07-31 1987-07-31 Method of sealing electronic component Pending JPS6436055A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62190464A JPS6436055A (en) 1987-07-31 1987-07-31 Method of sealing electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62190464A JPS6436055A (en) 1987-07-31 1987-07-31 Method of sealing electronic component

Publications (1)

Publication Number Publication Date
JPS6436055A true JPS6436055A (en) 1989-02-07

Family

ID=16258551

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62190464A Pending JPS6436055A (en) 1987-07-31 1987-07-31 Method of sealing electronic component

Country Status (1)

Country Link
JP (1) JPS6436055A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6157840U (en) * 1984-09-21 1986-04-18
JP2009200088A (en) * 2008-02-19 2009-09-03 Fuji Electric Device Technology Co Ltd Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6157840U (en) * 1984-09-21 1986-04-18
JP2009200088A (en) * 2008-02-19 2009-09-03 Fuji Electric Device Technology Co Ltd Semiconductor device

Similar Documents

Publication Publication Date Title
JPS5471572A (en) Semiconductor device
GB1337514A (en) Electrical circuit module and method of assembly
HK70887A (en) Semiconductor device and a method of producing the same
JPS5779652A (en) Resin-sealed semiconductor device
JPS55138241A (en) Sealing structure for semiconductor device
JPS642399A (en) Semiconductor device
JPS5588346A (en) Packaging method for semiconductor element
CA2017080A1 (en) Semiconductor device package structure
JPS57130443A (en) Substrate for hybrid integrated circuit
JPS57121255A (en) Electric circuit element with metallic bump and mounting method of the seme
JPH03198368A (en) Semiconductor device
JPS57154863A (en) Manufacture of resin sealing type electronic parts
JPS55138240A (en) Manufacture of semiconductor device
JPS5710951A (en) Semiconductor device
JPS5524478A (en) Integrated circuit
JPS5643748A (en) Mounting structure for ic
JPS57187955A (en) Sealing structure of semiconductor element
JPS6489356A (en) Hybrid integrated circuit
JPS6444027A (en) Semiconductor device
JPS6421945A (en) Electronic element mounting module
JPS57170542A (en) Semiconductor device
JPS6444030A (en) Semiconductor package
JPS56120147A (en) Integrated circuit package
JPS56105668A (en) Thick film hybrid ic
JPS6445136A (en) Method of mounting semiconductor element