JPS5481777A - Lead frame structure with intermediate layer - Google Patents

Lead frame structure with intermediate layer

Info

Publication number
JPS5481777A
JPS5481777A JP14971377A JP14971377A JPS5481777A JP S5481777 A JPS5481777 A JP S5481777A JP 14971377 A JP14971377 A JP 14971377A JP 14971377 A JP14971377 A JP 14971377A JP S5481777 A JPS5481777 A JP S5481777A
Authority
JP
Japan
Prior art keywords
copper
lead frame
substrate
metal substrate
plating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14971377A
Other languages
Japanese (ja)
Other versions
JPS5936425B2 (en
Inventor
Tomoyuki Furuyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Gakki Co Ltd
Original Assignee
Nippon Gakki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Gakki Co Ltd filed Critical Nippon Gakki Co Ltd
Priority to JP52149713A priority Critical patent/JPS5936425B2/en
Publication of JPS5481777A publication Critical patent/JPS5481777A/en
Publication of JPS5936425B2 publication Critical patent/JPS5936425B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To improve solderability specially of a thick silver plating layer by providing a Ni plating layer and alloy layer prior to silver plating of a copper- substrate metal substrate.
CONSTITUTION: A metal substrate of a copper substrate is plated temporarily with Ni to prevent copper from diffusing, Sn-Ni alloy or Sn-Co alloy layer is provided so as to improve soldering effect, and silver is plated. In this constitution, even if the silver plating layer is made thin by using a copper-based metal substrate, the deterioration of solderability lessens remarkably which is cuased by the heat oxidation of the lead frame.
COPYRIGHT: (C)1979,JPO&Japio
JP52149713A 1977-12-13 1977-12-13 Lead frame structure with intermediate layer Expired JPS5936425B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52149713A JPS5936425B2 (en) 1977-12-13 1977-12-13 Lead frame structure with intermediate layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52149713A JPS5936425B2 (en) 1977-12-13 1977-12-13 Lead frame structure with intermediate layer

Publications (2)

Publication Number Publication Date
JPS5481777A true JPS5481777A (en) 1979-06-29
JPS5936425B2 JPS5936425B2 (en) 1984-09-04

Family

ID=15481186

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52149713A Expired JPS5936425B2 (en) 1977-12-13 1977-12-13 Lead frame structure with intermediate layer

Country Status (1)

Country Link
JP (1) JPS5936425B2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59175754A (en) * 1983-03-26 1984-10-04 Furukawa Electric Co Ltd:The Lead frame for integrated circuit
JPS60147145A (en) * 1984-01-10 1985-08-03 Hitachi Cable Ltd Lead frame for semiconductor
JPS60225456A (en) * 1984-04-24 1985-11-09 Hitachi Cable Ltd Lead frame for semiconductor
JPS6127252U (en) * 1984-07-19 1986-02-18 古河電気工業株式会社 Strip material for semiconductor lead frames
JPS6149451A (en) * 1984-08-17 1986-03-11 Hitachi Cable Ltd Lead frame for semiconductor
US4707724A (en) * 1984-06-04 1987-11-17 Hitachi, Ltd. Semiconductor device and method of manufacturing thereof
US6207298B1 (en) * 1997-12-25 2001-03-27 Japan Solderless Terminal Mfg. Co., Ltd. Connector surface-treated with a Sn-Ni alloy

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59175754A (en) * 1983-03-26 1984-10-04 Furukawa Electric Co Ltd:The Lead frame for integrated circuit
JPS60147145A (en) * 1984-01-10 1985-08-03 Hitachi Cable Ltd Lead frame for semiconductor
JPS60225456A (en) * 1984-04-24 1985-11-09 Hitachi Cable Ltd Lead frame for semiconductor
US4707724A (en) * 1984-06-04 1987-11-17 Hitachi, Ltd. Semiconductor device and method of manufacturing thereof
JPS6127252U (en) * 1984-07-19 1986-02-18 古河電気工業株式会社 Strip material for semiconductor lead frames
JPS6149451A (en) * 1984-08-17 1986-03-11 Hitachi Cable Ltd Lead frame for semiconductor
US6207298B1 (en) * 1997-12-25 2001-03-27 Japan Solderless Terminal Mfg. Co., Ltd. Connector surface-treated with a Sn-Ni alloy

Also Published As

Publication number Publication date
JPS5936425B2 (en) 1984-09-04

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