JPS5487183A - Package for semiconductor device - Google Patents

Package for semiconductor device

Info

Publication number
JPS5487183A
JPS5487183A JP15444877A JP15444877A JPS5487183A JP S5487183 A JPS5487183 A JP S5487183A JP 15444877 A JP15444877 A JP 15444877A JP 15444877 A JP15444877 A JP 15444877A JP S5487183 A JPS5487183 A JP S5487183A
Authority
JP
Japan
Prior art keywords
cap
seal
package
hole
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15444877A
Other languages
Japanese (ja)
Other versions
JPS6040704B2 (en
Inventor
Hideya Yamamoto
Wahei Kitamura
Hiroshi Momona
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP52154448A priority Critical patent/JPS6040704B2/en
Publication of JPS5487183A publication Critical patent/JPS5487183A/en
Publication of JPS6040704B2 publication Critical patent/JPS6040704B2/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To reinforce the seal strength, by providing concave and convex or hole at ridge of the seal scheduled part of the package cap.
CONSTITUTION: The hole 2A or concave and convexe part 2B is formed at the seal acheduled part of the cap 2. Next, the cap is bonded with the bonding agent 3 such as glass flit on the opposing surface. Thus, the miniscas region of the adhesives 3 is remarkably increased and the bonding strength can effectively be increased.
COPYRIGHT: (C)1979,JPO&Japio
JP52154448A 1977-12-23 1977-12-23 Semiconductor device package Expired JPS6040704B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52154448A JPS6040704B2 (en) 1977-12-23 1977-12-23 Semiconductor device package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52154448A JPS6040704B2 (en) 1977-12-23 1977-12-23 Semiconductor device package

Publications (2)

Publication Number Publication Date
JPS5487183A true JPS5487183A (en) 1979-07-11
JPS6040704B2 JPS6040704B2 (en) 1985-09-12

Family

ID=15584423

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52154448A Expired JPS6040704B2 (en) 1977-12-23 1977-12-23 Semiconductor device package

Country Status (1)

Country Link
JP (1) JPS6040704B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60133640U (en) * 1984-02-13 1985-09-06 三菱電機株式会社 Hollow package for semiconductor devices
JPS6129155A (en) * 1984-07-19 1986-02-10 Fujitsu Ltd Semiconductor device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06221005A (en) * 1993-01-27 1994-08-09 Seiko Sangyo Kk Household toilet space unit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60133640U (en) * 1984-02-13 1985-09-06 三菱電機株式会社 Hollow package for semiconductor devices
JPS6129155A (en) * 1984-07-19 1986-02-10 Fujitsu Ltd Semiconductor device

Also Published As

Publication number Publication date
JPS6040704B2 (en) 1985-09-12

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