JPS51147176A - Method of semiconductor package - Google Patents

Method of semiconductor package

Info

Publication number
JPS51147176A
JPS51147176A JP50070594A JP7059475A JPS51147176A JP S51147176 A JPS51147176 A JP S51147176A JP 50070594 A JP50070594 A JP 50070594A JP 7059475 A JP7059475 A JP 7059475A JP S51147176 A JPS51147176 A JP S51147176A
Authority
JP
Japan
Prior art keywords
semiconductor package
solder
maintain
lead
main component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50070594A
Other languages
Japanese (ja)
Other versions
JPS5537858B2 (en
Inventor
Takehisa Sugawara
Teiichi Endo
Kunihiko Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP50070594A priority Critical patent/JPS51147176A/en
Publication of JPS51147176A publication Critical patent/JPS51147176A/en
Publication of JPS5537858B2 publication Critical patent/JPS5537858B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate

Landscapes

  • Casings For Electric Apparatus (AREA)

Abstract

PURPOSE: To be able to maintain a good condition of air tight sealing between the base and the cap during a long period of time even in a case using a solder with lead as a main component.
COPYRIGHT: (C)1976,JPO&Japio
JP50070594A 1975-06-11 1975-06-11 Method of semiconductor package Granted JPS51147176A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50070594A JPS51147176A (en) 1975-06-11 1975-06-11 Method of semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50070594A JPS51147176A (en) 1975-06-11 1975-06-11 Method of semiconductor package

Publications (2)

Publication Number Publication Date
JPS51147176A true JPS51147176A (en) 1976-12-17
JPS5537858B2 JPS5537858B2 (en) 1980-09-30

Family

ID=13436029

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50070594A Granted JPS51147176A (en) 1975-06-11 1975-06-11 Method of semiconductor package

Country Status (1)

Country Link
JP (1) JPS51147176A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58212150A (en) * 1982-06-02 1983-12-09 Mitsubishi Metal Corp Covering material for semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4837223A (en) * 1971-09-13 1973-06-01

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4837223A (en) * 1971-09-13 1973-06-01

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58212150A (en) * 1982-06-02 1983-12-09 Mitsubishi Metal Corp Covering material for semiconductor device

Also Published As

Publication number Publication date
JPS5537858B2 (en) 1980-09-30

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