JPS549582A - Sealing method of semiconductor device - Google Patents

Sealing method of semiconductor device

Info

Publication number
JPS549582A
JPS549582A JP7522577A JP7522577A JPS549582A JP S549582 A JPS549582 A JP S549582A JP 7522577 A JP7522577 A JP 7522577A JP 7522577 A JP7522577 A JP 7522577A JP S549582 A JPS549582 A JP S549582A
Authority
JP
Japan
Prior art keywords
semiconductor device
sealing method
touches
adhesion
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7522577A
Other languages
Japanese (ja)
Other versions
JPS588586B2 (en
Inventor
Shuichi Osaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP52075225A priority Critical patent/JPS588586B2/en
Publication of JPS549582A publication Critical patent/JPS549582A/en
Publication of JPS588586B2 publication Critical patent/JPS588586B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To increase the adhesion between the gas and the lead frame by forming at a low temperature a dense oxide film at the area which touches the sealing glass.
COPYRIGHT: (C)1979,JPO&Japio
JP52075225A 1977-06-23 1977-06-23 Sealing method for semiconductor devices Expired JPS588586B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52075225A JPS588586B2 (en) 1977-06-23 1977-06-23 Sealing method for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52075225A JPS588586B2 (en) 1977-06-23 1977-06-23 Sealing method for semiconductor devices

Publications (2)

Publication Number Publication Date
JPS549582A true JPS549582A (en) 1979-01-24
JPS588586B2 JPS588586B2 (en) 1983-02-16

Family

ID=13570059

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52075225A Expired JPS588586B2 (en) 1977-06-23 1977-06-23 Sealing method for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS588586B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58170046A (en) * 1982-03-31 1983-10-06 Fujitsu Ltd Semiconductor device
JPS58190048A (en) * 1982-04-30 1983-11-05 Hitachi Ltd Package of plastic sealed electronic parts
JPH0342194A (en) * 1989-07-10 1991-02-22 Mitsubishi Heavy Ind Ltd Marine propeller
EP0857355A4 (en) * 1996-08-28 1999-06-09 Motorola Inc GLASS / METAL PACKING AND PRODUCTION METHOD THEREFOR

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58170046A (en) * 1982-03-31 1983-10-06 Fujitsu Ltd Semiconductor device
JPS58190048A (en) * 1982-04-30 1983-11-05 Hitachi Ltd Package of plastic sealed electronic parts
JPH0342194A (en) * 1989-07-10 1991-02-22 Mitsubishi Heavy Ind Ltd Marine propeller
EP0857355A4 (en) * 1996-08-28 1999-06-09 Motorola Inc GLASS / METAL PACKING AND PRODUCTION METHOD THEREFOR

Also Published As

Publication number Publication date
JPS588586B2 (en) 1983-02-16

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