JPS5497367A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5497367A
JPS5497367A JP491778A JP491778A JPS5497367A JP S5497367 A JPS5497367 A JP S5497367A JP 491778 A JP491778 A JP 491778A JP 491778 A JP491778 A JP 491778A JP S5497367 A JPS5497367 A JP S5497367A
Authority
JP
Japan
Prior art keywords
lead
lead wire
semiconductor substrate
wire
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP491778A
Other languages
Japanese (ja)
Inventor
Hisao Kasuga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP491778A priority Critical patent/JPS5497367A/en
Publication of JPS5497367A publication Critical patent/JPS5497367A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To prevent an external lead wire and semiconductor substrate edge from coming in contact, and also to uniform the length of the lead wire after being cut by connecting one terminal of the lead wire to a protruding electrode while the lead extends upward from the semiconductor substrate.
CONSTITUTION: Lead wire 302 is so shaped that surface 303 confronting to semiconductor substrate 3 will form an angle of 306 degrees above the horizontal semiconductor against semiconductor substrate surface 305. Next, one terminal of the lead wire is connected to electrode 301 of the semiconductor element. In this way, it is prevented that lead wire 302 becomes easy to touch substrate edge 304 by being lowered below the horizontal against semiconductor substrate surface 305 due to its deformation under influence of heat, pressure, etc., at the time of a connection. Further, when the lead is cut and shaped, the unevenness of the lead-wire length due to the deformation of the lead can be prevented.
COPYRIGHT: (C)1979,JPO&Japio
JP491778A 1978-01-19 1978-01-19 Manufacture of semiconductor device Pending JPS5497367A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP491778A JPS5497367A (en) 1978-01-19 1978-01-19 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP491778A JPS5497367A (en) 1978-01-19 1978-01-19 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5497367A true JPS5497367A (en) 1979-08-01

Family

ID=11596970

Family Applications (1)

Application Number Title Priority Date Filing Date
JP491778A Pending JPS5497367A (en) 1978-01-19 1978-01-19 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5497367A (en)

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