JPS5498178A - Electronic device - Google Patents
Electronic deviceInfo
- Publication number
- JPS5498178A JPS5498178A JP436478A JP436478A JPS5498178A JP S5498178 A JPS5498178 A JP S5498178A JP 436478 A JP436478 A JP 436478A JP 436478 A JP436478 A JP 436478A JP S5498178 A JPS5498178 A JP S5498178A
- Authority
- JP
- Japan
- Prior art keywords
- cap
- trapezoid
- angle
- glass
- glass layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 abstract 4
- 238000007789 sealing Methods 0.000 abstract 2
- 230000001154 acute effect Effects 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 abstract 1
- 239000005394 sealing glass Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Landscapes
- Casings For Electric Apparatus (AREA)
Abstract
PURPOSE: To improve sealing strength of cap by adjusting the contact surface between the side of cap and the substrate to an acute angle or obtuse angle.
CONSTITUTION: If angle θ of the portion where cap 3 and glass layer 6 are kept in contact is kept at right angles, the sealing glass does not effectively wet and expand over the side of cap, thus resulting in weak resistance against thermal and mechanical strain. If bottom angle θ of trapezoid is set to 20W50° before sealing with glass, the side of trapezoid is covered with glass layer 6. When the cap is in the form of inversed trapezoid and angle θ between the side of trapezoid and vertical line is set to 30W60°, the glass layer between the side of cap and the surface of ceramic base 1 becomes thicker, thus improving the reliability of system.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP436478A JPS5498178A (en) | 1978-01-20 | 1978-01-20 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP436478A JPS5498178A (en) | 1978-01-20 | 1978-01-20 | Electronic device |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59081776A Division JPS6035542A (en) | 1984-04-25 | 1984-04-25 | Electronic device |
| JP60084483A Division JPS60242644A (en) | 1985-04-22 | 1985-04-22 | Electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5498178A true JPS5498178A (en) | 1979-08-02 |
Family
ID=11582313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP436478A Pending JPS5498178A (en) | 1978-01-20 | 1978-01-20 | Electronic device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5498178A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5911448U (en) * | 1982-07-13 | 1984-01-24 | 富士通株式会社 | semiconductor package |
| JPS60242644A (en) * | 1985-04-22 | 1985-12-02 | Hitachi Ltd | Electronic device |
| JPH02180053A (en) * | 1988-12-30 | 1990-07-12 | Narumi China Corp | Lead substrate for semiconductor package |
| US5825086A (en) * | 1993-08-27 | 1998-10-20 | Ngk Spark Plug Co., Ltd. | Ceramic lid assembly for semiconductor packages |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4929788A (en) * | 1972-07-18 | 1974-03-16 |
-
1978
- 1978-01-20 JP JP436478A patent/JPS5498178A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4929788A (en) * | 1972-07-18 | 1974-03-16 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5911448U (en) * | 1982-07-13 | 1984-01-24 | 富士通株式会社 | semiconductor package |
| JPS60242644A (en) * | 1985-04-22 | 1985-12-02 | Hitachi Ltd | Electronic device |
| JPH02180053A (en) * | 1988-12-30 | 1990-07-12 | Narumi China Corp | Lead substrate for semiconductor package |
| US5825086A (en) * | 1993-08-27 | 1998-10-20 | Ngk Spark Plug Co., Ltd. | Ceramic lid assembly for semiconductor packages |
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