JPS5498178A - Electronic device - Google Patents

Electronic device

Info

Publication number
JPS5498178A
JPS5498178A JP436478A JP436478A JPS5498178A JP S5498178 A JPS5498178 A JP S5498178A JP 436478 A JP436478 A JP 436478A JP 436478 A JP436478 A JP 436478A JP S5498178 A JPS5498178 A JP S5498178A
Authority
JP
Japan
Prior art keywords
cap
trapezoid
angle
glass
glass layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP436478A
Other languages
Japanese (ja)
Inventor
Tadayasu Nakajima
Shunji Koike
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP436478A priority Critical patent/JPS5498178A/en
Publication of JPS5498178A publication Critical patent/JPS5498178A/en
Pending legal-status Critical Current

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Abstract

PURPOSE: To improve sealing strength of cap by adjusting the contact surface between the side of cap and the substrate to an acute angle or obtuse angle.
CONSTITUTION: If angle θ of the portion where cap 3 and glass layer 6 are kept in contact is kept at right angles, the sealing glass does not effectively wet and expand over the side of cap, thus resulting in weak resistance against thermal and mechanical strain. If bottom angle θ of trapezoid is set to 20W50° before sealing with glass, the side of trapezoid is covered with glass layer 6. When the cap is in the form of inversed trapezoid and angle θ between the side of trapezoid and vertical line is set to 30W60°, the glass layer between the side of cap and the surface of ceramic base 1 becomes thicker, thus improving the reliability of system.
COPYRIGHT: (C)1979,JPO&Japio
JP436478A 1978-01-20 1978-01-20 Electronic device Pending JPS5498178A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP436478A JPS5498178A (en) 1978-01-20 1978-01-20 Electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP436478A JPS5498178A (en) 1978-01-20 1978-01-20 Electronic device

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP59081776A Division JPS6035542A (en) 1984-04-25 1984-04-25 Electronic device
JP60084483A Division JPS60242644A (en) 1985-04-22 1985-04-22 Electronic device

Publications (1)

Publication Number Publication Date
JPS5498178A true JPS5498178A (en) 1979-08-02

Family

ID=11582313

Family Applications (1)

Application Number Title Priority Date Filing Date
JP436478A Pending JPS5498178A (en) 1978-01-20 1978-01-20 Electronic device

Country Status (1)

Country Link
JP (1) JPS5498178A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5911448U (en) * 1982-07-13 1984-01-24 富士通株式会社 semiconductor package
JPS60242644A (en) * 1985-04-22 1985-12-02 Hitachi Ltd Electronic device
JPH02180053A (en) * 1988-12-30 1990-07-12 Narumi China Corp Lead substrate for semiconductor package
US5825086A (en) * 1993-08-27 1998-10-20 Ngk Spark Plug Co., Ltd. Ceramic lid assembly for semiconductor packages

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4929788A (en) * 1972-07-18 1974-03-16

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4929788A (en) * 1972-07-18 1974-03-16

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5911448U (en) * 1982-07-13 1984-01-24 富士通株式会社 semiconductor package
JPS60242644A (en) * 1985-04-22 1985-12-02 Hitachi Ltd Electronic device
JPH02180053A (en) * 1988-12-30 1990-07-12 Narumi China Corp Lead substrate for semiconductor package
US5825086A (en) * 1993-08-27 1998-10-20 Ngk Spark Plug Co., Ltd. Ceramic lid assembly for semiconductor packages

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