JPS55100239A - Seal bonding glass composition - Google Patents

Seal bonding glass composition

Info

Publication number
JPS55100239A
JPS55100239A JP554279A JP554279A JPS55100239A JP S55100239 A JPS55100239 A JP S55100239A JP 554279 A JP554279 A JP 554279A JP 554279 A JP554279 A JP 554279A JP S55100239 A JPS55100239 A JP S55100239A
Authority
JP
Japan
Prior art keywords
compsn
glass
glass composition
low
bonding glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP554279A
Other languages
Japanese (ja)
Other versions
JPS6143298B2 (en
Inventor
Yoshinori Kokubu
Jiro Chiba
Toshiyasu Kawaguchi
Nobuyoshi Ichimura
Takashi Iwai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Iwaki Glass Co Ltd
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Iwaki Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd, Iwaki Glass Co Ltd filed Critical Asahi Glass Co Ltd
Priority to JP554279A priority Critical patent/JPS55100239A/en
Priority to US06/109,079 priority patent/US4405722A/en
Priority to DE19803002353 priority patent/DE3002353A1/en
Publication of JPS55100239A publication Critical patent/JPS55100239A/en
Publication of JPS6143298B2 publication Critical patent/JPS6143298B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Ceramic Products (AREA)
  • Glass Compositions (AREA)

Abstract

PURPOSE: To provide a glass compsn. capable of airtightly seal-bonding alumina, having superior heat, water and acid resistances and superior insulating and dielectric properties, and consisting of PbO-B2O3-ZnO-SiO2 type low m.p. glass powder and a cordierite-contg. refractory filler of low expansibility.
CONSTITUTION: The glass compsn. consists of low m.p. glass powder having a compsn. composed of, by wt., PbO 77.0W86.0%, B2O3 6.1W15.0%, ZnO 0.5W 6.9%, SiO2 0.5W3.0%, Al2O3 0W3.0%, RO (RO is one or more out of BaO, SrO, CaO and MgO) 0W2.0% SnO2 0W1.5% and R2O (R2O is one or more out of Li2O, Na2O, K2O, Rb2O and Cs2O) 0W1.0% and a refractory filler composed of, by wt., cordierite 2.0W3.0%, β-eucryptite 0W30%, β-spodumene 0W30%, zirconium 0W50% and lead titanate 0W50%.
COPYRIGHT: (C)1980,JPO&Japio
JP554279A 1979-01-23 1979-01-23 Seal bonding glass composition Granted JPS55100239A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP554279A JPS55100239A (en) 1979-01-23 1979-01-23 Seal bonding glass composition
US06/109,079 US4405722A (en) 1979-01-23 1980-01-02 Sealing glass compositions
DE19803002353 DE3002353A1 (en) 1979-01-23 1980-01-23 GASKET GLASS

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP554279A JPS55100239A (en) 1979-01-23 1979-01-23 Seal bonding glass composition

Publications (2)

Publication Number Publication Date
JPS55100239A true JPS55100239A (en) 1980-07-31
JPS6143298B2 JPS6143298B2 (en) 1986-09-26

Family

ID=11614070

Family Applications (1)

Application Number Title Priority Date Filing Date
JP554279A Granted JPS55100239A (en) 1979-01-23 1979-01-23 Seal bonding glass composition

Country Status (1)

Country Link
JP (1) JPS55100239A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03167862A (en) * 1989-11-27 1991-07-19 Kyocera Corp Package for semiconductor-element
JPH03173162A (en) * 1989-11-30 1991-07-26 Kyocera Corp Package for housing semiconductor element
JPH03173157A (en) * 1989-11-30 1991-07-26 Kyocera Corp Package for housing semiconductor element
JPH03173161A (en) * 1989-11-30 1991-07-26 Kyocera Corp Package for housing semiconductor element
JPH06157082A (en) * 1992-11-17 1994-06-03 Ishizuka Glass Co Ltd Method for forming gap in glass bonding
KR970042353A (en) * 1995-12-15 1997-07-24 김익명 Insulating Glass Composition

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0178199U (en) * 1987-11-16 1989-05-25

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03167862A (en) * 1989-11-27 1991-07-19 Kyocera Corp Package for semiconductor-element
JPH03173162A (en) * 1989-11-30 1991-07-26 Kyocera Corp Package for housing semiconductor element
JPH03173157A (en) * 1989-11-30 1991-07-26 Kyocera Corp Package for housing semiconductor element
JPH03173161A (en) * 1989-11-30 1991-07-26 Kyocera Corp Package for housing semiconductor element
JPH06157082A (en) * 1992-11-17 1994-06-03 Ishizuka Glass Co Ltd Method for forming gap in glass bonding
KR970042353A (en) * 1995-12-15 1997-07-24 김익명 Insulating Glass Composition

Also Published As

Publication number Publication date
JPS6143298B2 (en) 1986-09-26

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