JPS551114A - Method and device for washing wafer - Google Patents

Method and device for washing wafer

Info

Publication number
JPS551114A
JPS551114A JP7321678A JP7321678A JPS551114A JP S551114 A JPS551114 A JP S551114A JP 7321678 A JP7321678 A JP 7321678A JP 7321678 A JP7321678 A JP 7321678A JP S551114 A JPS551114 A JP S551114A
Authority
JP
Japan
Prior art keywords
wafer
washing
main face
horn
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7321678A
Other languages
Japanese (ja)
Inventor
Yuzaburo Sakamoto
Norimasa Miyamoto
Masao Tsugi
Kazuo Kaneko
Shisei Yoneda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7321678A priority Critical patent/JPS551114A/en
Publication of JPS551114A publication Critical patent/JPS551114A/en
Pending legal-status Critical Current

Links

Landscapes

  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PURPOSE: To heighten a washing effect without damaging the main face of a wafer, by placing a vibrator at a small distance from the main face through a washing liquid and causing the vibrator to perform ultrasonic vibration.
CONSTITUTION: The wafter 2 is vacuum-attracted on a rest 1 and rotated at a high speed by a vertical shaft. An ultrasonic vibrating horn 4 is placed at the small distance from the surface of the wafer. The washing liquid 3 is supplied to the wafer so that the horn comes into contact with the surface of the liquid. The horn 4 is caused to vibrate vertically while it is moved horizontally, thereby uniformly washing the main face of the wafer. After the washing, the supply of the washing liquid is stopped and the wafer is rapidly rotated to be dried. The washing effect on the wafer is high.
COPYRIGHT: (C)1980,JPO&Japio
JP7321678A 1978-06-19 1978-06-19 Method and device for washing wafer Pending JPS551114A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7321678A JPS551114A (en) 1978-06-19 1978-06-19 Method and device for washing wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7321678A JPS551114A (en) 1978-06-19 1978-06-19 Method and device for washing wafer

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP12816085A Division JPS6116528A (en) 1985-06-14 1985-06-14 Wafer cleaning equipment

Publications (1)

Publication Number Publication Date
JPS551114A true JPS551114A (en) 1980-01-07

Family

ID=13511738

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7321678A Pending JPS551114A (en) 1978-06-19 1978-06-19 Method and device for washing wafer

Country Status (1)

Country Link
JP (1) JPS551114A (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59108598U (en) * 1983-01-10 1984-07-21 シャープ株式会社 clothes dryer
JPS63305517A (en) * 1987-06-05 1988-12-13 Puretetsuku:Kk Bar type washing nozzle
JPH0188942U (en) * 1987-12-02 1989-06-12
US4971920A (en) * 1987-11-28 1990-11-20 Kabushiki Kaisha Toshiba Gettering method for semiconductor wafers
US4980300A (en) * 1987-11-28 1990-12-25 Kabushiki Kaisha Toshiba Gettering method for a semiconductor wafer
US5071776A (en) * 1987-11-28 1991-12-10 Kabushiki Kaisha Toshiba Wafer processsing method for manufacturing wafers having contaminant-gettering damage on one surface
JP2002176021A (en) * 2000-12-05 2002-06-21 Honda Electronic Co Ltd Method and equipment for ultrasonic cleaning
US6684891B2 (en) 1996-09-30 2004-02-03 Verteq, Inc. Wafer cleaning
KR100416592B1 (en) * 2001-02-10 2004-02-05 삼성전자주식회사 single type wafer cleaning apparatus and wafer cleaning method using the same
KR100473475B1 (en) * 2002-08-09 2005-03-10 삼성전자주식회사 Apparatus for cleaning a substrate
KR100464118B1 (en) * 1997-08-05 2005-06-17 동경 엘렉트론 주식회사 Substrate cleaning device and substrate cleaning method
KR100873937B1 (en) 2007-09-19 2008-12-15 세메스 주식회사 Wafer cleaning apparatus and wafer cleaning method
US20150375334A1 (en) * 2014-06-25 2015-12-31 GM Global Technology Operations LLC Elimination of tool adhesion in an ultrasonic welding process

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4999480A (en) * 1973-01-02 1974-09-19

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4999480A (en) * 1973-01-02 1974-09-19

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59108598U (en) * 1983-01-10 1984-07-21 シャープ株式会社 clothes dryer
JPS63305517A (en) * 1987-06-05 1988-12-13 Puretetsuku:Kk Bar type washing nozzle
US4971920A (en) * 1987-11-28 1990-11-20 Kabushiki Kaisha Toshiba Gettering method for semiconductor wafers
US4980300A (en) * 1987-11-28 1990-12-25 Kabushiki Kaisha Toshiba Gettering method for a semiconductor wafer
US5071776A (en) * 1987-11-28 1991-12-10 Kabushiki Kaisha Toshiba Wafer processsing method for manufacturing wafers having contaminant-gettering damage on one surface
JPH0188942U (en) * 1987-12-02 1989-06-12
US7117876B2 (en) 1996-09-30 2006-10-10 Akrion Technologies, Inc. Method of cleaning a side of a thin flat substrate by applying sonic energy to the opposite side of the substrate
US6684891B2 (en) 1996-09-30 2004-02-03 Verteq, Inc. Wafer cleaning
US7518288B2 (en) * 1996-09-30 2009-04-14 Akrion Technologies, Inc. System for megasonic processing of an article
KR100464118B1 (en) * 1997-08-05 2005-06-17 동경 엘렉트론 주식회사 Substrate cleaning device and substrate cleaning method
JP2002176021A (en) * 2000-12-05 2002-06-21 Honda Electronic Co Ltd Method and equipment for ultrasonic cleaning
KR100416592B1 (en) * 2001-02-10 2004-02-05 삼성전자주식회사 single type wafer cleaning apparatus and wafer cleaning method using the same
KR100473475B1 (en) * 2002-08-09 2005-03-10 삼성전자주식회사 Apparatus for cleaning a substrate
KR100873937B1 (en) 2007-09-19 2008-12-15 세메스 주식회사 Wafer cleaning apparatus and wafer cleaning method
US20150375334A1 (en) * 2014-06-25 2015-12-31 GM Global Technology Operations LLC Elimination of tool adhesion in an ultrasonic welding process
US9573221B2 (en) * 2014-06-25 2017-02-21 GM Global Technology Operations LLC Elimination of tool adhesion in an ultrasonic welding process

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