JPS55136562A - Ultrasonic pre-soldering method and apparatus thereof - Google Patents

Ultrasonic pre-soldering method and apparatus thereof

Info

Publication number
JPS55136562A
JPS55136562A JP4206379A JP4206379A JPS55136562A JP S55136562 A JPS55136562 A JP S55136562A JP 4206379 A JP4206379 A JP 4206379A JP 4206379 A JP4206379 A JP 4206379A JP S55136562 A JPS55136562 A JP S55136562A
Authority
JP
Japan
Prior art keywords
ultrasonic horn
solder
soldered
metal substrate
ultrasonic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4206379A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6232021B2 (mo
Inventor
Tadao Kushima
Tomiro Yasuda
Tasao Soga
Hiroshi Kato
Taku Sugawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4206379A priority Critical patent/JPS55136562A/ja
Publication of JPS55136562A publication Critical patent/JPS55136562A/ja
Publication of JPS6232021B2 publication Critical patent/JPS6232021B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07125—Means for controlling the bonding environment, e.g. valves or vacuum pumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07341—Controlling the bonding environment, e.g. atmosphere composition or temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
JP4206379A 1979-04-09 1979-04-09 Ultrasonic pre-soldering method and apparatus thereof Granted JPS55136562A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4206379A JPS55136562A (en) 1979-04-09 1979-04-09 Ultrasonic pre-soldering method and apparatus thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4206379A JPS55136562A (en) 1979-04-09 1979-04-09 Ultrasonic pre-soldering method and apparatus thereof

Publications (2)

Publication Number Publication Date
JPS55136562A true JPS55136562A (en) 1980-10-24
JPS6232021B2 JPS6232021B2 (mo) 1987-07-11

Family

ID=12625634

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4206379A Granted JPS55136562A (en) 1979-04-09 1979-04-09 Ultrasonic pre-soldering method and apparatus thereof

Country Status (1)

Country Link
JP (1) JPS55136562A (mo)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5795639A (en) * 1980-12-04 1982-06-14 Sanyo Electric Co Ltd Forming method for preforming
WO2001034860A1 (de) * 1999-11-08 2001-05-17 Euromat Gesellschaft Für Werkstofftechnologie Und Transfer Mbh Lotlegierung
EP1195217A4 (en) * 1999-06-11 2003-07-23 Matsushita Electric Industrial Co Ltd METHOD FOR SOLDERING WITH LEAD-FREE SOLDERING MATERIAL AND WORKPIECE SOLDERED BY THIS METHOD
US20110272453A1 (en) * 2010-05-05 2011-11-10 Schott Solar Ag Method and device for introducing solder onto a workpiece
CH704991A1 (de) * 2011-05-23 2012-11-30 Esec Ag Verfahren zum Auftragen von Lot auf ein Substrat und Verfahren für die Montage von Halbleiterchips.
US8573467B2 (en) 2011-05-23 2013-11-05 Esec Ag Method for dispensing solder on a substrate and method for mounting semiconductor chips

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01156220A (ja) * 1987-12-12 1989-06-19 Masashi Mori 果実等の供給ホッパー

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5795639A (en) * 1980-12-04 1982-06-14 Sanyo Electric Co Ltd Forming method for preforming
EP1195217A4 (en) * 1999-06-11 2003-07-23 Matsushita Electric Industrial Co Ltd METHOD FOR SOLDERING WITH LEAD-FREE SOLDERING MATERIAL AND WORKPIECE SOLDERED BY THIS METHOD
US6702175B1 (en) 1999-06-11 2004-03-09 Matsushita Electric Industrial Co., Ltd. Method of soldering using lead-free solder and bonded article prepared through soldering by the method
WO2001034860A1 (de) * 1999-11-08 2001-05-17 Euromat Gesellschaft Für Werkstofftechnologie Und Transfer Mbh Lotlegierung
US20110272453A1 (en) * 2010-05-05 2011-11-10 Schott Solar Ag Method and device for introducing solder onto a workpiece
CH704991A1 (de) * 2011-05-23 2012-11-30 Esec Ag Verfahren zum Auftragen von Lot auf ein Substrat und Verfahren für die Montage von Halbleiterchips.
US8573467B2 (en) 2011-05-23 2013-11-05 Esec Ag Method for dispensing solder on a substrate and method for mounting semiconductor chips

Also Published As

Publication number Publication date
JPS6232021B2 (mo) 1987-07-11

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