JPS55148449A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS55148449A
JPS55148449A JP5586579A JP5586579A JPS55148449A JP S55148449 A JPS55148449 A JP S55148449A JP 5586579 A JP5586579 A JP 5586579A JP 5586579 A JP5586579 A JP 5586579A JP S55148449 A JPS55148449 A JP S55148449A
Authority
JP
Japan
Prior art keywords
electrodes
substrates
chips
semiconductor device
high frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5586579A
Other languages
English (en)
Japanese (ja)
Other versions
JPS617026B2 (cs
Inventor
Takashi Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP5586579A priority Critical patent/JPS55148449A/ja
Publication of JPS55148449A publication Critical patent/JPS55148449A/ja
Publication of JPS617026B2 publication Critical patent/JPS617026B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/226—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for HF amplifiers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

Landscapes

  • Bipolar Transistors (AREA)
JP5586579A 1979-05-08 1979-05-08 Semiconductor device Granted JPS55148449A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5586579A JPS55148449A (en) 1979-05-08 1979-05-08 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5586579A JPS55148449A (en) 1979-05-08 1979-05-08 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS55148449A true JPS55148449A (en) 1980-11-19
JPS617026B2 JPS617026B2 (cs) 1986-03-03

Family

ID=13010955

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5586579A Granted JPS55148449A (en) 1979-05-08 1979-05-08 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS55148449A (cs)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6048781A (ja) * 1983-08-30 1985-03-16 株式会社高木化学研究所 自動車用座席
US4563387A (en) * 1983-06-30 1986-01-07 Takagi Chemicals, Inc. Cushioning material
US4572430A (en) * 1983-08-17 1986-02-25 Takagi Chemicals, Inc. Air conditioner for vehicular seat

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52147973A (en) * 1976-06-03 1977-12-08 Nec Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52147973A (en) * 1976-06-03 1977-12-08 Nec Corp Semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4563387A (en) * 1983-06-30 1986-01-07 Takagi Chemicals, Inc. Cushioning material
US4572430A (en) * 1983-08-17 1986-02-25 Takagi Chemicals, Inc. Air conditioner for vehicular seat
JPS6048781A (ja) * 1983-08-30 1985-03-16 株式会社高木化学研究所 自動車用座席

Also Published As

Publication number Publication date
JPS617026B2 (cs) 1986-03-03

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