JPS55150247A - Parallel gap electrode and process for welding using the same - Google Patents

Parallel gap electrode and process for welding using the same

Info

Publication number
JPS55150247A
JPS55150247A JP5712379A JP5712379A JPS55150247A JP S55150247 A JPS55150247 A JP S55150247A JP 5712379 A JP5712379 A JP 5712379A JP 5712379 A JP5712379 A JP 5712379A JP S55150247 A JPS55150247 A JP S55150247A
Authority
JP
Japan
Prior art keywords
parallel gap
gap electrode
welding
wire
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5712379A
Other languages
Japanese (ja)
Inventor
Tadashi Okubo
Osamu Kasahara
Takafumi Kunishi
Taku Sugawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5712379A priority Critical patent/JPS55150247A/en
Publication of JPS55150247A publication Critical patent/JPS55150247A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To improve the workability for welding a small-sized article by forming a parallel gap electrode used for bonding a metallic wire of conical electrodes integrated in insulation with a basic cylinder. CONSTITUTION:A basic cylinder 8 becoming a holder having a feeding hole 9 for passing a bonding wire is made of hard insulating material or metallic material, and a conical parallel gap electrode 10 becoming a capillary mounted integrally with the lower portion of the cylinder 8 is made of metallic material such as Mo or the like. In this configuration the electrode 10 is made of two portions 10a, 10b, a tapered hole 13 for receiving a wire ball is formed at the end thereof, the insulating material 12 such as ethylene tetrafluoride or glass is coated on the seam between the portions 10a and 10b and the tapered inner surface. Thus, an electric current is flowed between the positions 10a and 10b to create a ball in the hole 13, molten solder is urged to the substrate to weld it without directivity.
JP5712379A 1979-05-11 1979-05-11 Parallel gap electrode and process for welding using the same Pending JPS55150247A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5712379A JPS55150247A (en) 1979-05-11 1979-05-11 Parallel gap electrode and process for welding using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5712379A JPS55150247A (en) 1979-05-11 1979-05-11 Parallel gap electrode and process for welding using the same

Publications (1)

Publication Number Publication Date
JPS55150247A true JPS55150247A (en) 1980-11-22

Family

ID=13046771

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5712379A Pending JPS55150247A (en) 1979-05-11 1979-05-11 Parallel gap electrode and process for welding using the same

Country Status (1)

Country Link
JP (1) JPS55150247A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62257738A (en) * 1986-04-28 1987-11-10 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション Welder for wire bonding
US6770833B2 (en) * 2001-06-12 2004-08-03 Yang Shi Tong Micro-welding electrode

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62257738A (en) * 1986-04-28 1987-11-10 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション Welder for wire bonding
US6770833B2 (en) * 2001-06-12 2004-08-03 Yang Shi Tong Micro-welding electrode

Similar Documents

Publication Publication Date Title
US6608286B2 (en) Versatile continuous welding electrode for short circuit welding
IT1161808B (en) WELDING MACHINE FOR WELDING EASY OXIDABLE METAL THREADS WITH THERMOCOMPRESSORS
SE7503388L (en) BACK WELDING KIT AND DEVICE.
JPS55150247A (en) Parallel gap electrode and process for welding using the same
DE3266725D1 (en) High voltage welding
US3466158A (en) Compound precious metal article having layer containing iridium or ruthenium
US3019330A (en) Electrode for inert gas shielded electric welding and cutting
US2523291A (en) Electric welding fixture
CN207402267U (en) Insulate soldering turret
JPS5596665A (en) Lead component for semiconductor element
JPS5584280A (en) Narrow groove submerged arc welding method
GB1465535A (en) Spot welding electrodes
GB1461223A (en) Method of and apparatus for plasma-mig arc welding
JPS57111056A (en) Semiconductor device
CN107649767A (en) Insulate soldering turret
KABANA et al. Butt welder for fine gauge tungsten/rhenium thermocouple wire(Electrical resistance butt welder for welding fine gauge tungsten/rhenium thermocouple wire)[Patent]
KR890008357Y1 (en) Arc welding electrode
JPS61152386U (en)
JPS60211951A (en) Wire-bonding device
JPS5630730A (en) Supporting electrode of semiconductor element
GB1098534A (en) Improvements in or relating to the manufacture of electrical components
JPS55150936A (en) Wire-cut electric discharge machine
KR810002591Y1 (en) Electrode of condenser
JPS56146262A (en) Manufacture of lead wire having metal of high melting point
JPS575347A (en) Semiconductor device