JPS55165659A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS55165659A
JPS55165659A JP7318179A JP7318179A JPS55165659A JP S55165659 A JPS55165659 A JP S55165659A JP 7318179 A JP7318179 A JP 7318179A JP 7318179 A JP7318179 A JP 7318179A JP S55165659 A JPS55165659 A JP S55165659A
Authority
JP
Japan
Prior art keywords
opening
carrier
board
radiator
central part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7318179A
Other languages
Japanese (ja)
Other versions
JPS6142865B2 (en
Inventor
Norio Honda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP7318179A priority Critical patent/JPS55165659A/en
Publication of JPS55165659A publication Critical patent/JPS55165659A/en
Publication of JPS6142865B2 publication Critical patent/JPS6142865B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To heighten a heat radiation effect, by providing an opening in the central part of a multilayer wiring board, bonding a chip carrier on the central part of the board so that a semiconductor element housed in the carrier is opposed to the opening and by placing a radiator, through which a coolant is passed, on the side of the wiring board opposite the chip carrier and directly cooling the carrier through the opening. CONSTITUTION:An opening 9 is provided in the central part of a multilayer wiring board 8 made of ceramic. A chip carrier 3 is fixed by a brazing material 7 so that a semiconductor element 1 housed in the carrier is opposed to the opening. A conductor film 5 is previously coated on the peripheral surface of the carrier 3. The conductor film is connected to the wiring of the board 8. The conductor film is coupled to the element 1 by a wire 2. A lid 4 is bonded by a brazing material 6 on the bottom of the chip carrier 3 to seal it up. A radiator 10 having a coolant inlet section 11 and a coolant outlet section 12 is secured on the top of the board 8 over the opening 9. Water 13 is caused to flow through the radiator to cool directly the carrier through the opening 9.
JP7318179A 1979-06-11 1979-06-11 Semiconductor device Granted JPS55165659A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7318179A JPS55165659A (en) 1979-06-11 1979-06-11 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7318179A JPS55165659A (en) 1979-06-11 1979-06-11 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS55165659A true JPS55165659A (en) 1980-12-24
JPS6142865B2 JPS6142865B2 (en) 1986-09-24

Family

ID=13510705

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7318179A Granted JPS55165659A (en) 1979-06-11 1979-06-11 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS55165659A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0603860A3 (en) * 1992-12-23 1995-03-15 Hughes Aircraft Co Integrated enlarged surface cooling for power modules.
CN107316852A (en) * 2017-08-08 2017-11-03 苏州能讯高能半导体有限公司 The radiator structure and semiconductor devices of a kind of semiconductor devices

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5599752A (en) * 1979-01-25 1980-07-30 Chiyou Lsi Gijutsu Kenkyu Kumiai Structure for fitting ic chip

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5599752A (en) * 1979-01-25 1980-07-30 Chiyou Lsi Gijutsu Kenkyu Kumiai Structure for fitting ic chip

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0603860A3 (en) * 1992-12-23 1995-03-15 Hughes Aircraft Co Integrated enlarged surface cooling for power modules.
CN107316852A (en) * 2017-08-08 2017-11-03 苏州能讯高能半导体有限公司 The radiator structure and semiconductor devices of a kind of semiconductor devices
CN107316852B (en) * 2017-08-08 2019-09-27 苏州能讯高能半导体有限公司 Heat dissipation structure of a semiconductor device and semiconductor device

Also Published As

Publication number Publication date
JPS6142865B2 (en) 1986-09-24

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