JPS6431443A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6431443A
JPS6431443A JP62188174A JP18817487A JPS6431443A JP S6431443 A JPS6431443 A JP S6431443A JP 62188174 A JP62188174 A JP 62188174A JP 18817487 A JP18817487 A JP 18817487A JP S6431443 A JPS6431443 A JP S6431443A
Authority
JP
Japan
Prior art keywords
chip
heat sink
leads
manufacturing cost
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62188174A
Other languages
Japanese (ja)
Inventor
Kenji Okada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62188174A priority Critical patent/JPS6431443A/en
Publication of JPS6431443A publication Critical patent/JPS6431443A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To shorten a manufacturing process and to reduce a manufacturing cost by placing a semiconductor chip directly on a heat sink to remove the heat generated at the chip. CONSTITUTION:In a device, a semiconductor chip 2 is directly mounted on a heat sink 1 of aluminum with heat sink fins at the outside, a bonding pad on the chip is wired by bonding wirings 4 to the leads 3 of a lead frame bonded by an adhesive on the insulated sink 1, the chip 2 is covered with silicone resin 5 to protect the chip 2, and the leads 3 are so shaped as to be able to mount on the surface. Accordingly, the manufacturing steps can be shortened to largely reduce the manufacturing cost.
JP62188174A 1987-07-27 1987-07-27 Semiconductor device Pending JPS6431443A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62188174A JPS6431443A (en) 1987-07-27 1987-07-27 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62188174A JPS6431443A (en) 1987-07-27 1987-07-27 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6431443A true JPS6431443A (en) 1989-02-01

Family

ID=16219055

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62188174A Pending JPS6431443A (en) 1987-07-27 1987-07-27 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6431443A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5168926A (en) * 1991-09-25 1992-12-08 Intel Corporation Heat sink design integrating interface material
US5530295A (en) * 1993-12-29 1996-06-25 Intel Corporation Drop-in heat sink
US5552960A (en) * 1994-04-14 1996-09-03 Intel Corporation Collapsible cooling apparatus for portable computer
US5912802A (en) * 1994-06-30 1999-06-15 Intel Corporation Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system
EP0777271A3 (en) * 1995-11-30 1999-07-21 Mitsubishi Denki Kabushiki Kaisha Semiconductor device comprising a lead frame and a heat sink
KR100235750B1 (en) * 1997-05-13 1999-12-15 김규현 Semiconductor package
KR100352116B1 (en) * 1996-12-06 2002-12-16 앰코 테크놀로지 코리아 주식회사 Heat dissipation easy semiconductor package structure
US7381684B2 (en) 2001-10-16 2008-06-03 Lintec Corporation Method for using a rewritable thermal label

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5370672A (en) * 1976-12-06 1978-06-23 Ibm Ic assembly
JPS5389664A (en) * 1977-01-19 1978-08-07 Hitachi Ltd Package structure of semiconductor device
JPS59117244A (en) * 1982-12-24 1984-07-06 Hitachi Tokyo Electronics Co Ltd Semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5370672A (en) * 1976-12-06 1978-06-23 Ibm Ic assembly
JPS5389664A (en) * 1977-01-19 1978-08-07 Hitachi Ltd Package structure of semiconductor device
JPS59117244A (en) * 1982-12-24 1984-07-06 Hitachi Tokyo Electronics Co Ltd Semiconductor device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5168926A (en) * 1991-09-25 1992-12-08 Intel Corporation Heat sink design integrating interface material
US5530295A (en) * 1993-12-29 1996-06-25 Intel Corporation Drop-in heat sink
US5552960A (en) * 1994-04-14 1996-09-03 Intel Corporation Collapsible cooling apparatus for portable computer
US5912802A (en) * 1994-06-30 1999-06-15 Intel Corporation Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system
EP0777271A3 (en) * 1995-11-30 1999-07-21 Mitsubishi Denki Kabushiki Kaisha Semiconductor device comprising a lead frame and a heat sink
KR100352116B1 (en) * 1996-12-06 2002-12-16 앰코 테크놀로지 코리아 주식회사 Heat dissipation easy semiconductor package structure
KR100235750B1 (en) * 1997-05-13 1999-12-15 김규현 Semiconductor package
US7381684B2 (en) 2001-10-16 2008-06-03 Lintec Corporation Method for using a rewritable thermal label

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