JPS5242372A - Process for production of semiconductor device - Google Patents

Process for production of semiconductor device

Info

Publication number
JPS5242372A
JPS5242372A JP50118165A JP11816575A JPS5242372A JP S5242372 A JPS5242372 A JP S5242372A JP 50118165 A JP50118165 A JP 50118165A JP 11816575 A JP11816575 A JP 11816575A JP S5242372 A JPS5242372 A JP S5242372A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
mold
clearances
flash
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50118165A
Other languages
Japanese (ja)
Inventor
Yutaka Morita
Kaoru Ishihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP50118165A priority Critical patent/JPS5242372A/en
Publication of JPS5242372A publication Critical patent/JPS5242372A/en
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To prevent resin mold "flash" through the clearances at mold parting lines during resin sealing, in a transfer molding method for elements using a lead frame.
COPYRIGHT: (C)1977,JPO&Japio
JP50118165A 1975-09-30 1975-09-30 Process for production of semiconductor device Pending JPS5242372A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50118165A JPS5242372A (en) 1975-09-30 1975-09-30 Process for production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50118165A JPS5242372A (en) 1975-09-30 1975-09-30 Process for production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5242372A true JPS5242372A (en) 1977-04-01

Family

ID=14729706

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50118165A Pending JPS5242372A (en) 1975-09-30 1975-09-30 Process for production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5242372A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63197364A (en) * 1987-02-12 1988-08-16 Goto Seisakusho:Kk Manufacture of semiconductor device
US4942455A (en) * 1986-10-13 1990-07-17 Mitsubishi Denki Kabushiki Kaisha Lead frame for a semiconductor device and a method for manufacturing a semiconductor device using the lead frame

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4942455A (en) * 1986-10-13 1990-07-17 Mitsubishi Denki Kabushiki Kaisha Lead frame for a semiconductor device and a method for manufacturing a semiconductor device using the lead frame
US5026669A (en) * 1986-10-13 1991-06-25 Mitsubishi Denki Kabushiki Kaisha Method of eliminating burrs on a lead frame with a thin metal coating
JPS63197364A (en) * 1987-02-12 1988-08-16 Goto Seisakusho:Kk Manufacture of semiconductor device

Similar Documents

Publication Publication Date Title
JPS5239587A (en) Mold releasing agent
JPS5381073A (en) Oroduction of resin seal type semiconductor device and lead frame used the same
JPS5242372A (en) Process for production of semiconductor device
JPS5211866A (en) Resin sealing method in a semiconductor device
JPS5228869A (en) Process for molding and the mold and heat-radiation header for the pro cess
JPS51112273A (en) Lead frame for resin mold type semiconductor device
JPS532078A (en) Sealing structure for semiconductor device
JPS5298472A (en) Lead frame for resin molding
JPS5275180A (en) Package for integrated circuits
JPS5214359A (en) Process for sealing of the semiconductor and lead-frame used in this method
JPS5287982A (en) Resin molding method of semiconductor elements
JPS5369581A (en) Manufacture for resin sealed type semiconductor device
JPS5522873A (en) Manufacturing method of resin sealing semiconductor device
JPS5260842A (en) Process for manufacturing polyvinyl alcohol molded products
JPS522378A (en) Semiconductor device manufacturing method
JPS52167A (en) Method of marking semiconductor
JPS5219081A (en) Production method of semiconductor device
JPS53115176A (en) Production of resn mold type semiconductor device
JPS51112726A (en) Process for molding surfaces which efficiently absorb solar energy
JPS51140480A (en) Method of fabticating semiconductor device
JPS52179A (en) Method of fabricating semiconductor
JPS5559750A (en) Lead frame
JPS51117381A (en) Device for replacing metallic mold in press
JPS5333576A (en) Ic molding method
JPS5394179A (en) Lead frame