JPS5521154A - Ceramic package - Google Patents

Ceramic package

Info

Publication number
JPS5521154A
JPS5521154A JP9412478A JP9412478A JPS5521154A JP S5521154 A JPS5521154 A JP S5521154A JP 9412478 A JP9412478 A JP 9412478A JP 9412478 A JP9412478 A JP 9412478A JP S5521154 A JPS5521154 A JP S5521154A
Authority
JP
Japan
Prior art keywords
cavity
face
metal layer
conductive metal
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9412478A
Other languages
Japanese (ja)
Other versions
JPS5914894B2 (en
Inventor
Takeshi Suzuki
Michio Asai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Priority to JP53094124A priority Critical patent/JPS5914894B2/en
Publication of JPS5521154A publication Critical patent/JPS5521154A/en
Publication of JPS5914894B2 publication Critical patent/JPS5914894B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To obtain a small ceramic package capable of accommodating an electronic parts of a high integration rate having a multi-terminal in a cavity by providing a slot in the side of a conductive metallic layer connected to a conduction on a circuit substrate of a leadless ceramic package.
CONSTITUTION: A conductive metal layer 4 is derived from a cavity 2 on the opening end face 3 of a ceramic made leadless package body 1 to be used for an external electrode pad 4a and a slot 6 is provided in the pad 4a. A lead 8 is connected from an electronic part element 7 mounted on a conductive metal layer 5 in the inner face of the cavity 2 to a corresponding conductive metal layer 4 and the cavity upper face is sealed with a ceramic made cover 9. Whereby a corresponding pattern of the circuit substrate is connected to the external electrode pad 4a directly by a solder and others while directing the opening end face 3 downward, therefore, when the electronic parts of a high integration rate having a multi-terminal are accommodated, the package can be miniaturized without lowering its characteristic.
COPYRIGHT: (C)1980,JPO&Japio
JP53094124A 1978-08-03 1978-08-03 Ceramic package Expired JPS5914894B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP53094124A JPS5914894B2 (en) 1978-08-03 1978-08-03 Ceramic package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP53094124A JPS5914894B2 (en) 1978-08-03 1978-08-03 Ceramic package

Publications (2)

Publication Number Publication Date
JPS5521154A true JPS5521154A (en) 1980-02-15
JPS5914894B2 JPS5914894B2 (en) 1984-04-06

Family

ID=14101663

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53094124A Expired JPS5914894B2 (en) 1978-08-03 1978-08-03 Ceramic package

Country Status (1)

Country Link
JP (1) JPS5914894B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5559746A (en) * 1978-10-27 1980-05-06 Hitachi Ltd Semiconductor device and its mounting circuit device
EP0036671A1 (en) * 1980-03-26 1981-09-30 Siemens Aktiengesellschaft Container for electrical devices, groups of devices or integrated circuits
JPS59229840A (en) * 1983-05-30 1984-12-24 Rohm Co Ltd Semiconductor device
US4638348A (en) * 1982-08-10 1987-01-20 Brown David F Semiconductor chip carrier
JPH03116949A (en) * 1989-09-29 1991-05-17 Enplas Corp Manufacture of ic package and ic package case
KR100431315B1 (en) * 1997-06-26 2004-10-06 주식회사 하이닉스반도체 Chip size package fabricated by simple process and fabricating method thereof to reduce manufacturing cost

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5559746A (en) * 1978-10-27 1980-05-06 Hitachi Ltd Semiconductor device and its mounting circuit device
EP0036671A1 (en) * 1980-03-26 1981-09-30 Siemens Aktiengesellschaft Container for electrical devices, groups of devices or integrated circuits
US4638348A (en) * 1982-08-10 1987-01-20 Brown David F Semiconductor chip carrier
JPS59229840A (en) * 1983-05-30 1984-12-24 Rohm Co Ltd Semiconductor device
JPH03116949A (en) * 1989-09-29 1991-05-17 Enplas Corp Manufacture of ic package and ic package case
KR100431315B1 (en) * 1997-06-26 2004-10-06 주식회사 하이닉스반도체 Chip size package fabricated by simple process and fabricating method thereof to reduce manufacturing cost

Also Published As

Publication number Publication date
JPS5914894B2 (en) 1984-04-06

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