JPS5522709A - Photo semiconductor element package - Google Patents
Photo semiconductor element packageInfo
- Publication number
- JPS5522709A JPS5522709A JP9451378A JP9451378A JPS5522709A JP S5522709 A JPS5522709 A JP S5522709A JP 9451378 A JP9451378 A JP 9451378A JP 9451378 A JP9451378 A JP 9451378A JP S5522709 A JPS5522709 A JP S5522709A
- Authority
- JP
- Japan
- Prior art keywords
- stem
- cap
- bonding
- semiconductor element
- annular groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/421—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Light Receiving Elements (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
PURPOSE:To perform coupling of a cap and a stem in a short time with a simple structure and enable the internal airtightness to be surely maintained by providing an annular groove filled with coupling material to the flange part for bonding of stem circumferential edge. CONSTITUTION:A photo semiconductor element 6 such as LED is secured onto the metallized layer 1 formed on the surface of the support plate 10 on a metal-made stem 2 and the respective electrodes thereof are connected by means of the layer 11 and lead wires 12 to the lead terminals 5, 5 secured by glass 13 onto the stem 2. A metal sleeve 8 for protection inserted and fixed with an optical fiber 9 is fixed by means of resin 7 in the central part of a cap 1. The lower part of the cap 1 is fitted into the annular groove 15 having an upward circumferential wall 14 of the flange part 3 for bonding of the stem 2 and ring solder 4 is hot melted in the circumference thereof. In this state, the cap 1 and stem 2 are aligned and butted together in such a manner that the fiber 9 and element 6 assume the maximum coupling efficiency, after which the solder 4 is allowed to cool by itself.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9451378A JPS5522709A (en) | 1978-08-04 | 1978-08-04 | Photo semiconductor element package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9451378A JPS5522709A (en) | 1978-08-04 | 1978-08-04 | Photo semiconductor element package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5522709A true JPS5522709A (en) | 1980-02-18 |
Family
ID=14112396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9451378A Pending JPS5522709A (en) | 1978-08-04 | 1978-08-04 | Photo semiconductor element package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5522709A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5793590A (en) * | 1980-12-03 | 1982-06-10 | Nec Corp | Optical fiber coupling semiconductor device |
| WO1982002957A1 (en) * | 1981-02-23 | 1982-09-02 | Inc Motorola | Improved fiber optics semiconductor package |
| FR2536867A1 (en) * | 1982-11-30 | 1984-06-01 | Thomson Csf | METHOD OF ALIGNING AN OPTOELECTRONIC DEVICE |
| DE3606588A1 (en) * | 1986-02-28 | 1987-09-03 | Siemens Ag | GAS DENSITY THROUGH A FIBER |
| US4707066A (en) * | 1983-10-12 | 1987-11-17 | Siemens Aktiengesellschaft | Glass fiber bushing through a wall opening of a housing and method of manufacture |
| US4834490A (en) * | 1982-12-03 | 1989-05-30 | Siemens Aktiengesellschaft | Transmitting receiving device with a diode mounted on a support |
-
1978
- 1978-08-04 JP JP9451378A patent/JPS5522709A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5793590A (en) * | 1980-12-03 | 1982-06-10 | Nec Corp | Optical fiber coupling semiconductor device |
| WO1982002957A1 (en) * | 1981-02-23 | 1982-09-02 | Inc Motorola | Improved fiber optics semiconductor package |
| FR2536867A1 (en) * | 1982-11-30 | 1984-06-01 | Thomson Csf | METHOD OF ALIGNING AN OPTOELECTRONIC DEVICE |
| US4728787A (en) * | 1982-11-30 | 1988-03-01 | Thomson-Csf | Alignment process for an electro-optical device |
| US4834490A (en) * | 1982-12-03 | 1989-05-30 | Siemens Aktiengesellschaft | Transmitting receiving device with a diode mounted on a support |
| US4707066A (en) * | 1983-10-12 | 1987-11-17 | Siemens Aktiengesellschaft | Glass fiber bushing through a wall opening of a housing and method of manufacture |
| DE3606588A1 (en) * | 1986-02-28 | 1987-09-03 | Siemens Ag | GAS DENSITY THROUGH A FIBER |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4058821A (en) | Photo-coupler semiconductor device and method of manufacturing the same | |
| JPS5522713A (en) | Connector mechanism of photo semiconductor device | |
| JPS5522709A (en) | Photo semiconductor element package | |
| JPS5522711A (en) | Photo semiconductor element package | |
| JPS5522710A (en) | Photo semiconductor element package | |
| GB1251837A (en) | ||
| JPS568863A (en) | Substrate for semiconductor device | |
| JPS57207357A (en) | Component part holder | |
| JPS54105992A (en) | Optical semiconductor device | |
| JPS54161271A (en) | Semiconductor device | |
| JPS5565448A (en) | Ceramic package for semiconductor device | |
| JPS54129880A (en) | Manufacture for semiconductor device | |
| JPS54112167A (en) | Manufacture of semiconductor device | |
| JPS55165653A (en) | Semiconductor device | |
| JPS5650545A (en) | Resin molded type semiconductor device | |
| JPS645079A (en) | Semiconductor light emitting device | |
| JPS61225879A (en) | Solid-state relay device | |
| JPS54127691A (en) | Semiconductor light emission device | |
| JPS6020950Y2 (en) | Bowl-shaped case-enclosed diode | |
| JPS5522712A (en) | Photo semiconductor element package | |
| JPS561576A (en) | Light semiconductor device | |
| JPS55128839A (en) | Semiconductor device | |
| JPS5637656A (en) | Airtight container with light transmission opening | |
| JPS5763849A (en) | Semiconductor device | |
| JPS58124248A (en) | Semiconductor device |