JPS57207357A - Component part holder - Google Patents

Component part holder

Info

Publication number
JPS57207357A
JPS57207357A JP56092138A JP9213881A JPS57207357A JP S57207357 A JPS57207357 A JP S57207357A JP 56092138 A JP56092138 A JP 56092138A JP 9213881 A JP9213881 A JP 9213881A JP S57207357 A JPS57207357 A JP S57207357A
Authority
JP
Japan
Prior art keywords
resin
convex parts
substrate
hole
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56092138A
Other languages
Japanese (ja)
Inventor
Toshio Minowa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Priority to JP56092138A priority Critical patent/JPS57207357A/en
Publication of JPS57207357A publication Critical patent/JPS57207357A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H10W70/413—Insulating or insulated substrates serving as die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To seal semiconductor elements and connection wires without outflow of resin, by opening a film substrate for lead wires crossing the openings to provide convex parts on the periphery of a substrate surrounded by opening parts. CONSTITUTION:Si elements 11 are joined on the high heat resistant glass epoxy film 12 connected by lead wires 14, 15, and the lead 14 crosses the hole 16 on the substrate 12. Convex parts 7 are provided inside the hole 16. The element 11 is mounted for connection to provide resin 19. Owing to the existence of the convex parts 17, resin supplied at constant amount rarely flows out. Therefore, disconnections of the wire 15 due to the internal strain after resin transfer and hardening do not occur.
JP56092138A 1981-06-17 1981-06-17 Component part holder Pending JPS57207357A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56092138A JPS57207357A (en) 1981-06-17 1981-06-17 Component part holder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56092138A JPS57207357A (en) 1981-06-17 1981-06-17 Component part holder

Publications (1)

Publication Number Publication Date
JPS57207357A true JPS57207357A (en) 1982-12-20

Family

ID=14046066

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56092138A Pending JPS57207357A (en) 1981-06-17 1981-06-17 Component part holder

Country Status (1)

Country Link
JP (1) JPS57207357A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5027190A (en) * 1987-07-16 1991-06-25 Gao Gesellschaft Fur Automation Und Organisation Mbh Carrier element to be incorporated into an identity card
US5196992A (en) * 1989-08-25 1993-03-23 Kabushiki Kaisha Toshiba Resin sealing type semiconductor device in which a very small semiconductor chip is sealed in package with resin
US5304513A (en) * 1987-07-16 1994-04-19 Gao Gesellschaft Fur Automation Und Organisation Mbh Method for manufacturing an encapsulated semiconductor package using an adhesive barrier frame

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5081272A (en) * 1973-11-16 1975-07-01

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5081272A (en) * 1973-11-16 1975-07-01

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5027190A (en) * 1987-07-16 1991-06-25 Gao Gesellschaft Fur Automation Und Organisation Mbh Carrier element to be incorporated into an identity card
US5304513A (en) * 1987-07-16 1994-04-19 Gao Gesellschaft Fur Automation Und Organisation Mbh Method for manufacturing an encapsulated semiconductor package using an adhesive barrier frame
US5196992A (en) * 1989-08-25 1993-03-23 Kabushiki Kaisha Toshiba Resin sealing type semiconductor device in which a very small semiconductor chip is sealed in package with resin

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