JPS5522832A - Semiconconductor manufacturing apparatus and method of manufacturing semiconductor device by use of its apparatus - Google Patents

Abstract

PURPOSE: To effect the reduction in process treatment time by arranging the apparatus for transferring the semiconductor wafers with the regist to the baking treatment process in parallel, allocating the wafers to either of apparatus just before being entered therein and sending them on the parallel belts within the apparatus alternately.

CONSTITUTION: Each semiconductor wafer 1 with the regist is transferred to a direction indicating guide 32 by use of an air bearing 31 and then proceeded to right or left path alternately at that point. Next, the wafer 1 allocated to either path is transferred via a wafer guide 33, air bearing 34 and induction revolution shaft 35 with high coefficient of friction made of heat resisting rubber to a belt 27 made of phosphor copper, which is located on a preheater 27, driven by use of induction revolution shafts 39 and 40. After that, the wafer is sent to a baking treatment process with the aid of an induction revolution shaft 37, guide 41 and bearing 42. On the other hand, the wafer 1 allocated to the other path by the direction indicating guide 32 is also transferred via a belt 28 in parallel to the belt 27 into the baking treatment process through the same course as that for the preceded wafer 1.

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