JPS553928A - Method of removing resin burr and metal mold - Google Patents

Method of removing resin burr and metal mold

Info

Publication number
JPS553928A
JPS553928A JP7646478A JP7646478A JPS553928A JP S553928 A JPS553928 A JP S553928A JP 7646478 A JP7646478 A JP 7646478A JP 7646478 A JP7646478 A JP 7646478A JP S553928 A JPS553928 A JP S553928A
Authority
JP
Japan
Prior art keywords
lead
resin
resin burr
lead frame
semiconductor pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7646478A
Other languages
Japanese (ja)
Inventor
Hiroshi Takao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7646478A priority Critical patent/JPS553928A/en
Publication of JPS553928A publication Critical patent/JPS553928A/en
Pending legal-status Critical Current

Links

Landscapes

  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

PURPOSE: To remove easily a resin burr is a dam by fitting a projetion to the resin burr and pushing the projection when a semiconductor pellet is fixed in the tab part of a lead frame and molded.
CONSTITUTION: A semiconductor pellet 2 is fixed to a given place of a lead frame 1 punched in a metal plate and the semiconductor pellet 2 and a lead piece of the lead frame 1 are connected by a bonding wire and then on upper and a lower metal mold 71, 72 are combined. When they 71, 72 are placed face to face through the lead feame, a main space 5 having the same shape as the external one of resin in a semiconductor device is formed and auxiliary spaces are set in which the sectional size of the space between the upper and the lower mold 71, 72 becomes larger than that of the lead frames as they approach the dam parts 15. When resin is poured in these spaces and hardens, the projection which is formed in the auxiliary spaces is pushed in the direction normal to the lead frames 1 and burrs are removed.
COPYRIGHT: (C)1980,JPO&Japio
JP7646478A 1978-06-26 1978-06-26 Method of removing resin burr and metal mold Pending JPS553928A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7646478A JPS553928A (en) 1978-06-26 1978-06-26 Method of removing resin burr and metal mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7646478A JPS553928A (en) 1978-06-26 1978-06-26 Method of removing resin burr and metal mold

Publications (1)

Publication Number Publication Date
JPS553928A true JPS553928A (en) 1980-01-12

Family

ID=13605878

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7646478A Pending JPS553928A (en) 1978-06-26 1978-06-26 Method of removing resin burr and metal mold

Country Status (1)

Country Link
JP (1) JPS553928A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4501540A (en) * 1981-12-24 1985-02-26 Toyota Jidosha Kabushiki Kaisha Insert molding device
US4862586A (en) * 1985-02-28 1989-09-05 Michio Osada Lead frame for enclosing semiconductor chips with resin

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4501540A (en) * 1981-12-24 1985-02-26 Toyota Jidosha Kabushiki Kaisha Insert molding device
US4862586A (en) * 1985-02-28 1989-09-05 Michio Osada Lead frame for enclosing semiconductor chips with resin

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