JPS5522873A - Manufacturing method of resin sealing semiconductor device - Google Patents

Manufacturing method of resin sealing semiconductor device

Info

Publication number
JPS5522873A
JPS5522873A JP9689378A JP9689378A JPS5522873A JP S5522873 A JPS5522873 A JP S5522873A JP 9689378 A JP9689378 A JP 9689378A JP 9689378 A JP9689378 A JP 9689378A JP S5522873 A JPS5522873 A JP S5522873A
Authority
JP
Japan
Prior art keywords
resin
protruded
block
lead frame
radiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9689378A
Other languages
Japanese (ja)
Inventor
Hideyoshi Yano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP9689378A priority Critical patent/JPS5522873A/en
Publication of JPS5522873A publication Critical patent/JPS5522873A/en
Pending legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

PURPOSE: To relieve a labor and improve a quality by restricting to a necessary and nimimum limit a sealing resin protruded in performing a resin sealing process.
CONSTITUTION: A slot-like resin reservoir 6 is provided in a predetermined location on a radiation block, a slot-like resin reservoir 8 is also provided in a predetermined location on a metallic mold 7 and the size of the slots is determined depending upon the resin amount protruded. The radiation block 1, lead frame 3 and semiconductor chip 2 are set on the metallic mold 7 to be sealed by a resin 5 injection. In this case, the resin 5 is protruded to the intermediate portion between 3 the metallic block 7 and radiation block 1 or the metallic mold 7 and lead frame is introduced to the reservoirs 6 and 8 to block the resin protruded to the lead frame or radiation block. Therefore, a removing work of the resin protruded can be eliminated without reducing a radiation effect.
COPYRIGHT: (C)1980,JPO&Japio
JP9689378A 1978-08-08 1978-08-08 Manufacturing method of resin sealing semiconductor device Pending JPS5522873A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9689378A JPS5522873A (en) 1978-08-08 1978-08-08 Manufacturing method of resin sealing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9689378A JPS5522873A (en) 1978-08-08 1978-08-08 Manufacturing method of resin sealing semiconductor device

Publications (1)

Publication Number Publication Date
JPS5522873A true JPS5522873A (en) 1980-02-18

Family

ID=14177052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9689378A Pending JPS5522873A (en) 1978-08-08 1978-08-08 Manufacturing method of resin sealing semiconductor device

Country Status (1)

Country Link
JP (1) JPS5522873A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56147102A (en) * 1980-04-17 1981-11-14 Konishiroku Photo Ind Co Ltd Plastic lens
JPS6278840A (en) * 1985-10-01 1987-04-11 Rohm Co Ltd Molding process of electronic parts
JPH01123426A (en) * 1987-11-07 1989-05-16 Sanken Electric Co Ltd Manufacture of resin sealed electronic component
US6969918B1 (en) 2001-08-30 2005-11-29 Micron Technology, Inc. System for fabricating semiconductor components using mold cavities having runners configured to minimize venting

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56147102A (en) * 1980-04-17 1981-11-14 Konishiroku Photo Ind Co Ltd Plastic lens
JPS6278840A (en) * 1985-10-01 1987-04-11 Rohm Co Ltd Molding process of electronic parts
JPH01123426A (en) * 1987-11-07 1989-05-16 Sanken Electric Co Ltd Manufacture of resin sealed electronic component
US6969918B1 (en) 2001-08-30 2005-11-29 Micron Technology, Inc. System for fabricating semiconductor components using mold cavities having runners configured to minimize venting
US7186589B2 (en) 2001-08-30 2007-03-06 Micron Technology, Inc. Method for fabricating semiconductor components using mold cavities having runners configured to minimize venting
US7265453B2 (en) 2001-08-30 2007-09-04 Micron Technology, Inc. Semiconductor component having dummy segments with trapped corner air

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