JPS5541279A - Resin enclosing device - Google Patents

Resin enclosing device

Info

Publication number
JPS5541279A
JPS5541279A JP11535878A JP11535878A JPS5541279A JP S5541279 A JPS5541279 A JP S5541279A JP 11535878 A JP11535878 A JP 11535878A JP 11535878 A JP11535878 A JP 11535878A JP S5541279 A JPS5541279 A JP S5541279A
Authority
JP
Japan
Prior art keywords
metal mold
slippage
chases
thermal expansion
center blocks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11535878A
Other languages
Japanese (ja)
Inventor
Kazuki Yamashita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP11535878A priority Critical patent/JPS5541279A/en
Publication of JPS5541279A publication Critical patent/JPS5541279A/en
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE: To prevent the positional slippage of products due to thermal deformation and thermal expansion produced under the conditions of the set temperature that seals resin, by mounting convex portions and concave portions to chases and center blocks.
CONSTITUTION: Positional slippage preventive pins 15 and guide bushes 16 are installed to upper and lower chases 5, 6 and center blocks 7, 8 without using the guide posts and guide bushes of a mold metal mold. Since thermal expansion, thermal deformation and elongation of a metal mold base are rigidly free and orientation and positioning are performed only in upper and lower each chase in this metal mold, slippage in other directions is prevented.
COPYRIGHT: (C)1980,JPO&Japio
JP11535878A 1978-09-19 1978-09-19 Resin enclosing device Pending JPS5541279A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11535878A JPS5541279A (en) 1978-09-19 1978-09-19 Resin enclosing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11535878A JPS5541279A (en) 1978-09-19 1978-09-19 Resin enclosing device

Publications (1)

Publication Number Publication Date
JPS5541279A true JPS5541279A (en) 1980-03-24

Family

ID=14660543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11535878A Pending JPS5541279A (en) 1978-09-19 1978-09-19 Resin enclosing device

Country Status (1)

Country Link
JP (1) JPS5541279A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58157609U (en) * 1982-04-16 1983-10-21 松下電器産業株式会社 Molding equipment
JPH02249612A (en) * 1989-03-23 1990-10-05 Yamada Seisakusho:Kk Mold apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58157609U (en) * 1982-04-16 1983-10-21 松下電器産業株式会社 Molding equipment
JPH02249612A (en) * 1989-03-23 1990-10-05 Yamada Seisakusho:Kk Mold apparatus

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