JPS51114874A - Semiconductor device formation method - Google Patents

Semiconductor device formation method

Info

Publication number
JPS51114874A
JPS51114874A JP50039100A JP3910075A JPS51114874A JP S51114874 A JPS51114874 A JP S51114874A JP 50039100 A JP50039100 A JP 50039100A JP 3910075 A JP3910075 A JP 3910075A JP S51114874 A JPS51114874 A JP S51114874A
Authority
JP
Japan
Prior art keywords
semiconductor device
formation method
device formation
outer package
metal lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50039100A
Other languages
Japanese (ja)
Other versions
JPS5241186B2 (en
Inventor
Kanji Otsuka
Tamotsu Usami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50039100A priority Critical patent/JPS51114874A/en
Publication of JPS51114874A publication Critical patent/JPS51114874A/en
Publication of JPS5241186B2 publication Critical patent/JPS5241186B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Ceramic Products (AREA)

Abstract

PURPOSE: Obtain low-cost semiconductor devices by piling a metal lid on a conductive material made of a frame-like thick metalized layer provided on the upper-most surface of a ceramic outer package, and welding the metal lid on the outer package by the seam welding method to seal.
COPYRIGHT: (C)1976,JPO&Japio
JP50039100A 1975-04-02 1975-04-02 Semiconductor device formation method Granted JPS51114874A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50039100A JPS51114874A (en) 1975-04-02 1975-04-02 Semiconductor device formation method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50039100A JPS51114874A (en) 1975-04-02 1975-04-02 Semiconductor device formation method

Publications (2)

Publication Number Publication Date
JPS51114874A true JPS51114874A (en) 1976-10-08
JPS5241186B2 JPS5241186B2 (en) 1977-10-17

Family

ID=12543645

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50039100A Granted JPS51114874A (en) 1975-04-02 1975-04-02 Semiconductor device formation method

Country Status (1)

Country Link
JP (1) JPS51114874A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5878443A (en) * 1981-11-04 1983-05-12 Nec Corp Manufacture of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5878443A (en) * 1981-11-04 1983-05-12 Nec Corp Manufacture of semiconductor device

Also Published As

Publication number Publication date
JPS5241186B2 (en) 1977-10-17

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