JPS5553902A - Manufacture of microwave strip circuit - Google Patents

Manufacture of microwave strip circuit

Info

Publication number
JPS5553902A
JPS5553902A JP12708478A JP12708478A JPS5553902A JP S5553902 A JPS5553902 A JP S5553902A JP 12708478 A JP12708478 A JP 12708478A JP 12708478 A JP12708478 A JP 12708478A JP S5553902 A JPS5553902 A JP S5553902A
Authority
JP
Japan
Prior art keywords
substrate
circuit
strip
manufacture
conductive adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12708478A
Other languages
Japanese (ja)
Inventor
Norio Yabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP12708478A priority Critical patent/JPS5553902A/en
Publication of JPS5553902A publication Critical patent/JPS5553902A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
    • H01P11/003—Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Waveguides (AREA)

Abstract

PURPOSE:To realize manufacture of the strip circuit without using any specific pressing tool by using the conductive adhesive sheet containing a number of holes. CONSTITUTION:Dielectric substrate 3 having strip pattern 4 on the upper surface is mounted onto earth substrate 1. In this case, substrate 3 is piled on conductive adhesive sheet 2 containing holes 5. In such way, numbers of microwave strip circuits are arranged on substrate 1 to form a packaged function circuit 8. Circuit 8 is then put into the pressure container to receive the pressure and heat, thus carrying out bonding between substrata 3 and 1. In this case, some difference is caused between the pressure applied to substrate 3 corresponding to the area of the hole on sheet 2 and the area with no hole drilled. As a result, substrate 3 is pressed strongly onto substrate 1 to be bonded together firmly. In such way, the strip circuit can be manufactured without using any specific pressing tool.
JP12708478A 1978-10-16 1978-10-16 Manufacture of microwave strip circuit Pending JPS5553902A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12708478A JPS5553902A (en) 1978-10-16 1978-10-16 Manufacture of microwave strip circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12708478A JPS5553902A (en) 1978-10-16 1978-10-16 Manufacture of microwave strip circuit

Publications (1)

Publication Number Publication Date
JPS5553902A true JPS5553902A (en) 1980-04-19

Family

ID=14951174

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12708478A Pending JPS5553902A (en) 1978-10-16 1978-10-16 Manufacture of microwave strip circuit

Country Status (1)

Country Link
JP (1) JPS5553902A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5095616A (en) * 1990-10-26 1992-03-17 Tektronix, Inc. Grounding method for use in high frequency electrical circuitry

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5095616A (en) * 1990-10-26 1992-03-17 Tektronix, Inc. Grounding method for use in high frequency electrical circuitry

Similar Documents

Publication Publication Date Title
USD279670S (en) Component side of a printed circuit board
US3538389A (en) Subelement for electronic circuit board
EP0238929A3 (en) Process for providing circuit lines on a substrate
JPS5553902A (en) Manufacture of microwave strip circuit
JPS5258468A (en) Production of ceramic package
DE3752286D1 (en) Isolation formed in a deep trench with contact on the surface of the substrate
JPS54139358A (en) Antenna unit and its production
JPS56114361A (en) Semiconductor container
US2893150A (en) Wiring board and method of construction
EP0138673A3 (en) Method of making a printed circuit board
JPS5737839A (en) Manufacture of hybrid integrated circuit
EP0151501A3 (en) Method and device for arranging a wire-shaped element in a given pattern between layers of material or webs of material
JPS5520520A (en) Data input unit
JPS6450551A (en) Ic package structure
JPS5560917A (en) Liquid crystal display device
JPS6457653A (en) Mounting structure of hybrid integrated circuit component
JPS55158657A (en) Electronic device
JPS5669850A (en) Method for sealing semiconductor device
WO1979000825A1 (en) Metallic tone decorative plate
JPS55145360A (en) Semiconductor device
KR910010681A (en) Manufacturing method of ceramic package
JPS5436386A (en) Decorative board having relief pattern
JPS5595930A (en) Fully solid type electrochromic display device
JPS5591835A (en) Electronic device
JPS5676543A (en) Semiconductor element