JPS5555540A - Method of fabricating semiconductor device - Google Patents

Method of fabricating semiconductor device

Info

Publication number
JPS5555540A
JPS5555540A JP12798178A JP12798178A JPS5555540A JP S5555540 A JPS5555540 A JP S5555540A JP 12798178 A JP12798178 A JP 12798178A JP 12798178 A JP12798178 A JP 12798178A JP S5555540 A JPS5555540 A JP S5555540A
Authority
JP
Japan
Prior art keywords
lead frame
semiconductor
hole
center line
carrying unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12798178A
Other languages
Japanese (ja)
Inventor
Hidenori Nishida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP12798178A priority Critical patent/JPS5555540A/en
Publication of JPS5555540A publication Critical patent/JPS5555540A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To prevent fabrication of an improper semiconductor by displacing the positioning hole of a lead frame from the center line of a semiconductor carrying unit to thereby disable positioning of the semiconductor when the lead frame is fed in back side.
CONSTITUTION: The positioning hole 203 of a lead frame 202 is provided out of extended center line of a semiconductor carrying unit 205, and the positioning pin 204 of a lead frame retainer 201 is further provided at the portion corresponding to the hole 203 out of the extended center line of the carrying unit 205. When the lead frame 202 is erroneously fed in back side, the pin 204 does not enter into the hole 203 to thereby cause interruption of work. Since the work is thus interrupted, it does not fabricate an improper semiconductor device.
COPYRIGHT: (C)1980,JPO&Japio
JP12798178A 1978-10-18 1978-10-18 Method of fabricating semiconductor device Pending JPS5555540A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12798178A JPS5555540A (en) 1978-10-18 1978-10-18 Method of fabricating semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12798178A JPS5555540A (en) 1978-10-18 1978-10-18 Method of fabricating semiconductor device

Publications (1)

Publication Number Publication Date
JPS5555540A true JPS5555540A (en) 1980-04-23

Family

ID=14973477

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12798178A Pending JPS5555540A (en) 1978-10-18 1978-10-18 Method of fabricating semiconductor device

Country Status (1)

Country Link
JP (1) JPS5555540A (en)

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