JPS556318B2 - - Google Patents
Info
- Publication number
- JPS556318B2 JPS556318B2 JP11437875A JP11437875A JPS556318B2 JP S556318 B2 JPS556318 B2 JP S556318B2 JP 11437875 A JP11437875 A JP 11437875A JP 11437875 A JP11437875 A JP 11437875A JP S556318 B2 JPS556318 B2 JP S556318B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA209,786A CA1009027A (en) | 1974-09-23 | 1974-09-23 | Method of producing printed circuit boards in multiple units |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51136176A JPS51136176A (en) | 1976-11-25 |
| JPS556318B2 true JPS556318B2 (ja) | 1980-02-15 |
Family
ID=4101198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50114378A Granted JPS51136176A (en) | 1974-09-23 | 1975-09-23 | Method of manufacturing printed circuit board |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JPS51136176A (ja) |
| CA (1) | CA1009027A (ja) |
| DE (1) | DE2541667A1 (ja) |
| FR (1) | FR2285784A1 (ja) |
| GB (1) | GB1474504A (ja) |
| NL (1) | NL7511148A (ja) |
| SE (1) | SE7510670L (ja) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59181090A (ja) * | 1983-03-30 | 1984-10-15 | 日本メクトロン株式会社 | 回路基板の製造法 |
| JPH06338671A (ja) * | 1993-05-31 | 1994-12-06 | Sankyo Seiki Mfg Co Ltd | プリント基板の製造方法 |
| NL1016701C2 (nl) * | 2000-11-24 | 2002-05-27 | Fico Bv | Werkwijze en inrichting voor het uit een vlakke drager verwijderen van een dragerdeel. |
| CN103817745B (zh) * | 2014-02-24 | 2016-05-25 | 昆山苏杭电路板有限公司 | 小单元印制板冲板工艺 |
| DE102015116563A1 (de) | 2015-09-30 | 2017-03-30 | Valeo Schalter Und Sensoren Gmbh | Verfahren zum Herstellen von Elektronikkomponenten für Sensoren eines Kraftfahrzeugs |
-
1974
- 1974-09-23 CA CA209,786A patent/CA1009027A/en not_active Expired
-
1975
- 1975-09-12 GB GB3762975A patent/GB1474504A/en not_active Expired
- 1975-09-18 DE DE19752541667 patent/DE2541667A1/de active Pending
- 1975-09-22 NL NL7511148A patent/NL7511148A/xx not_active Application Discontinuation
- 1975-09-23 FR FR7529158A patent/FR2285784A1/fr not_active Withdrawn
- 1975-09-23 JP JP50114378A patent/JPS51136176A/ja active Granted
- 1975-09-23 SE SE7510670A patent/SE7510670L/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| SE7510670L (sv) | 1976-03-24 |
| FR2285784A1 (fr) | 1976-04-16 |
| GB1474504A (en) | 1977-05-25 |
| NL7511148A (nl) | 1976-03-25 |
| CA1009027A (en) | 1977-04-26 |
| JPS51136176A (en) | 1976-11-25 |
| DE2541667A1 (de) | 1976-04-08 |