JPS5565450A - Resin-mold type semiconductor device - Google Patents

Resin-mold type semiconductor device

Info

Publication number
JPS5565450A
JPS5565450A JP13787878A JP13787878A JPS5565450A JP S5565450 A JPS5565450 A JP S5565450A JP 13787878 A JP13787878 A JP 13787878A JP 13787878 A JP13787878 A JP 13787878A JP S5565450 A JPS5565450 A JP S5565450A
Authority
JP
Japan
Prior art keywords
header
mold part
pellet
resin
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13787878A
Other languages
Japanese (ja)
Inventor
Susumu Okikawa
Hiromichi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13787878A priority Critical patent/JPS5565450A/en
Publication of JPS5565450A publication Critical patent/JPS5565450A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To improve the humidity resistance of a device, by providing on the upper side of the header on which a semiconductor pellet is to be mounted vertically cut grooves arranged along the edges of a mold part. CONSTITUTION:A plurality of V-shaped grooves 17 are placed on both sides of the place of mounting pellet 16 on header 15, made of metal of good heat conductivity. Next, in addition to these, on one side, L-shaped groove 18, which has vertical wall 20 and slanting wall 21, is cut on the edge of mold part 19 to be provided on this. On the other side, by cutting header 15, slanted surface 22 is formed. Subsequently, lead 24 is connected to the electrode of pellet 16 via wire 25. Lead 24 is projected outward, and mold part 19, which covers pellet 16 and wire 25, is formed on header 15. By this, mold part 19 is prevented from shifting, and no deterioration in the element characteristics occurs.
JP13787878A 1978-11-10 1978-11-10 Resin-mold type semiconductor device Pending JPS5565450A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13787878A JPS5565450A (en) 1978-11-10 1978-11-10 Resin-mold type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13787878A JPS5565450A (en) 1978-11-10 1978-11-10 Resin-mold type semiconductor device

Publications (1)

Publication Number Publication Date
JPS5565450A true JPS5565450A (en) 1980-05-16

Family

ID=15208796

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13787878A Pending JPS5565450A (en) 1978-11-10 1978-11-10 Resin-mold type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5565450A (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6110262A (en) * 1984-06-26 1986-01-17 Toshiba Corp Device for manufacturing semiconductor lead frame
JPS6151852A (en) * 1984-08-21 1986-03-14 Ibiden Co Ltd Printed circuit board and manufacture thereof
US5305344A (en) * 1993-04-29 1994-04-19 Opto Power Corporation Laser diode array
US5514913A (en) * 1991-12-05 1996-05-07 Consorzio Per La Ricerca Sulla Microelettronica Net Mezzogiorno Resin-encapsulated semiconductor device having improved adhesion
US5985684A (en) * 1996-04-30 1999-11-16 Cutting Edge Optronics, Inc. Process for manufacturing a laser diode having a heat sink
US6310900B1 (en) 1998-04-30 2001-10-30 Cutting Edge Optronics, Inc. Laser diode package with heat sink
FR2837022A1 (en) * 2002-03-08 2003-09-12 Mitsubishi Electric Corp POWER SEMICONDUCTOR DEVICE
US6636538B1 (en) 1999-03-29 2003-10-21 Cutting Edge Optronics, Inc. Laser diode packaging
JP2005159276A (en) * 2003-10-28 2005-06-16 Matsushita Electric Works Ltd Semiconductor light emitting device and manufacturing method thereof
US7170919B2 (en) 2003-06-23 2007-01-30 Northrop Grumman Corporation Diode-pumped solid-state laser gain module
JP2011176017A (en) * 2010-02-23 2011-09-08 Stanley Electric Co Ltd Light emitting device and method for manufacturing the same
JP2014120759A (en) * 2012-12-13 2014-06-30 Samsung Electro-Mechanics Co Ltd Common mode filter and method of manufacturing the same
JP2018082517A (en) * 2016-11-14 2018-05-24 ファナック株式会社 Motor

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5437264U (en) * 1977-08-17 1979-03-10
JPS5535809U (en) * 1978-08-25 1980-03-07
JPS5535807U (en) * 1978-08-28 1980-03-07
JPS5541022A (en) * 1978-09-15 1980-03-22 Matsushita Electric Works Ltd Photo oscillation circuit

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5437264U (en) * 1977-08-17 1979-03-10
JPS5535809U (en) * 1978-08-25 1980-03-07
JPS5535807U (en) * 1978-08-28 1980-03-07
JPS5541022A (en) * 1978-09-15 1980-03-22 Matsushita Electric Works Ltd Photo oscillation circuit

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6110262A (en) * 1984-06-26 1986-01-17 Toshiba Corp Device for manufacturing semiconductor lead frame
JPS6151852A (en) * 1984-08-21 1986-03-14 Ibiden Co Ltd Printed circuit board and manufacture thereof
US5514913A (en) * 1991-12-05 1996-05-07 Consorzio Per La Ricerca Sulla Microelettronica Net Mezzogiorno Resin-encapsulated semiconductor device having improved adhesion
US5766985A (en) * 1991-12-05 1998-06-16 Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno Process for encapsulating a semiconductor device having a heat sink
US5305344A (en) * 1993-04-29 1994-04-19 Opto Power Corporation Laser diode array
US5985684A (en) * 1996-04-30 1999-11-16 Cutting Edge Optronics, Inc. Process for manufacturing a laser diode having a heat sink
US6310900B1 (en) 1998-04-30 2001-10-30 Cutting Edge Optronics, Inc. Laser diode package with heat sink
US6636538B1 (en) 1999-03-29 2003-10-21 Cutting Edge Optronics, Inc. Laser diode packaging
US7060515B2 (en) 1999-03-29 2006-06-13 Cutting Edge Optronics, Inc. Method of manufacturing a laser diode package
US7361978B2 (en) 1999-03-29 2008-04-22 Northrop Gruman Corporation Laser diode packaging
FR2837022A1 (en) * 2002-03-08 2003-09-12 Mitsubishi Electric Corp POWER SEMICONDUCTOR DEVICE
US6979843B2 (en) 2002-03-08 2005-12-27 Mitsubishi Denki Kabushiki Kaisha Power semiconductor device
US7170919B2 (en) 2003-06-23 2007-01-30 Northrop Grumman Corporation Diode-pumped solid-state laser gain module
JP2005159276A (en) * 2003-10-28 2005-06-16 Matsushita Electric Works Ltd Semiconductor light emitting device and manufacturing method thereof
JP2011176017A (en) * 2010-02-23 2011-09-08 Stanley Electric Co Ltd Light emitting device and method for manufacturing the same
JP2014120759A (en) * 2012-12-13 2014-06-30 Samsung Electro-Mechanics Co Ltd Common mode filter and method of manufacturing the same
JP2018082517A (en) * 2016-11-14 2018-05-24 ファナック株式会社 Motor

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