JPS5568679A - Semiconductor pressure sensor and fabrication of the same - Google Patents

Semiconductor pressure sensor and fabrication of the same

Info

Publication number
JPS5568679A
JPS5568679A JP14102578A JP14102578A JPS5568679A JP S5568679 A JPS5568679 A JP S5568679A JP 14102578 A JP14102578 A JP 14102578A JP 14102578 A JP14102578 A JP 14102578A JP S5568679 A JPS5568679 A JP S5568679A
Authority
JP
Japan
Prior art keywords
substrate
crystalline orientation
exposed
pressure sensor
diaphragm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14102578A
Other languages
Japanese (ja)
Inventor
Yasuhiro Mochizuki
Kanji Kawakami
Komei Yatsuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14102578A priority Critical patent/JPS5568679A/en
Publication of JPS5568679A publication Critical patent/JPS5568679A/en
Pending legal-status Critical Current

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  • Pressure Sensors (AREA)

Abstract

PURPOSE: To obtain a highly accurate semiconductor pressure sensor inexpensively by adhering a first semiconductor substrate exposed at a plane (110) to a second semiconductor substrate for supporting it and exposed at a plane (100), forming a gauge resistance layer in the first substrate and machining the second substrate to form a diaphragm thereat.
CONSTITUTION: The surface of a supporting second silicon substrate 22 is mirror finished in its crystalline orientation (100), and adhered with a first silicon substrate 21 similarly mirror finished in its crystalline orientation (110) through a boron silicate film 23 thereto. Then, the exposed surface of the substrate 21 is mirror polished to form predetermined thickness of a diaphragm and to coat it with SiO2 film 24. Then, boron is diffused by a selective diffusion process to thereby form two types of gauge resistance layers 25 in the substrate 21 in such a manner that the one is formed in its diametrical direction and the other in its tangential direction as bridge construction having less nonlinear error. It is then etched by alkaline solution utilizing the crystalline orientation (100) of the second substrate 22 to thereby retain the substrate 22 only at its periphery.
COPYRIGHT: (C)1980,JPO&Japio
JP14102578A 1978-11-17 1978-11-17 Semiconductor pressure sensor and fabrication of the same Pending JPS5568679A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14102578A JPS5568679A (en) 1978-11-17 1978-11-17 Semiconductor pressure sensor and fabrication of the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14102578A JPS5568679A (en) 1978-11-17 1978-11-17 Semiconductor pressure sensor and fabrication of the same

Publications (1)

Publication Number Publication Date
JPS5568679A true JPS5568679A (en) 1980-05-23

Family

ID=15282452

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14102578A Pending JPS5568679A (en) 1978-11-17 1978-11-17 Semiconductor pressure sensor and fabrication of the same

Country Status (1)

Country Link
JP (1) JPS5568679A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6199430B1 (en) 1997-06-17 2001-03-13 Denso Corporation Acceleration sensor with ring-shaped movable electrode
US6388300B1 (en) 1999-01-25 2002-05-14 Denso Corporation Semiconductor physical quantity sensor and method of manufacturing the same
US6653702B2 (en) 2000-06-13 2003-11-25 Denso Corporation Semiconductor pressure sensor having strain gauge and circuit portion on semiconductor substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6199430B1 (en) 1997-06-17 2001-03-13 Denso Corporation Acceleration sensor with ring-shaped movable electrode
US6388300B1 (en) 1999-01-25 2002-05-14 Denso Corporation Semiconductor physical quantity sensor and method of manufacturing the same
US6653702B2 (en) 2000-06-13 2003-11-25 Denso Corporation Semiconductor pressure sensor having strain gauge and circuit portion on semiconductor substrate

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