JPS5585048A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5585048A
JPS5585048A JP15749878A JP15749878A JPS5585048A JP S5585048 A JPS5585048 A JP S5585048A JP 15749878 A JP15749878 A JP 15749878A JP 15749878 A JP15749878 A JP 15749878A JP S5585048 A JPS5585048 A JP S5585048A
Authority
JP
Japan
Prior art keywords
screws
resin body
resin
mounting
grooves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15749878A
Other languages
Japanese (ja)
Inventor
Mitsuo Ito
Yukio Usami
Makoto Sakamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15749878A priority Critical patent/JPS5585048A/en
Publication of JPS5585048A publication Critical patent/JPS5585048A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent a resin body from forming cracks when clamping screws, by providing grooves between the resin body for sealing a semiconductor pellet and resin bodies for installing screws. CONSTITUTION:A semiconductor pellet 5 is disposed to a central portion of a metallic flange portion 3, and three leads 6a, 6b, 6c containing what are connected to the electrodes of the pellet 5 through wires (gold wires). The pellet 5 is sealed by a resin body 1 and resin bodies 8 for mounting screws for fitting, which extend from the resin body 1 and of which holes 2 conforming to the screws for fitting are made up in fitting holes 7 for mounting, on the flange 3. Since grooves 9 are provided between the resin body 1 and the resin bodies 8 for mounting the screws so as to cross the portions between the resin body 1 and the resin bodies 8 and clamping stress in the case when mounting the screws is interrupted at the grooves 9, the formation of cracks to the resin body 1 can be prevented. Difference in stages may be installed in place of the grooves 9.
JP15749878A 1978-12-22 1978-12-22 Semiconductor device Pending JPS5585048A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15749878A JPS5585048A (en) 1978-12-22 1978-12-22 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15749878A JPS5585048A (en) 1978-12-22 1978-12-22 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5585048A true JPS5585048A (en) 1980-06-26

Family

ID=15650989

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15749878A Pending JPS5585048A (en) 1978-12-22 1978-12-22 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5585048A (en)

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