JPS5629355A - Manufacture of resin-sealed semiconductor device - Google Patents

Manufacture of resin-sealed semiconductor device

Info

Publication number
JPS5629355A
JPS5629355A JP10537779A JP10537779A JPS5629355A JP S5629355 A JPS5629355 A JP S5629355A JP 10537779 A JP10537779 A JP 10537779A JP 10537779 A JP10537779 A JP 10537779A JP S5629355 A JPS5629355 A JP S5629355A
Authority
JP
Japan
Prior art keywords
resin
burr
semiconductor device
manufacture
sealed semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10537779A
Other languages
Japanese (ja)
Inventor
Kazunari Michii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP10537779A priority Critical patent/JPS5629355A/en
Publication of JPS5629355A publication Critical patent/JPS5629355A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To remove burr of a resin-sealed semiconductor device without damaging the semiconductor by etching a metallic film preformed on an externally led conductor after sealing resin therewith. CONSTITUTION:A lead frame 5 plated at 4 with the portion externally led from a sealing resin 2 at the lead wire 1a is prepared. The plating thickness 4 may be preferably higher than 5. After assembling as prescribed, it is sealed with resin 2, and the plated film 4 is etched. Then, a gap 6 is produced between the lead wire 1a and the burr 3. When compressed air is blown to the burr 3, the burr 3 can be easily removed.
JP10537779A 1979-08-18 1979-08-18 Manufacture of resin-sealed semiconductor device Pending JPS5629355A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10537779A JPS5629355A (en) 1979-08-18 1979-08-18 Manufacture of resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10537779A JPS5629355A (en) 1979-08-18 1979-08-18 Manufacture of resin-sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPS5629355A true JPS5629355A (en) 1981-03-24

Family

ID=14405984

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10537779A Pending JPS5629355A (en) 1979-08-18 1979-08-18 Manufacture of resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS5629355A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5271148A (en) * 1988-11-17 1993-12-21 National Semiconductor Corporation Method of producing a leadframe
JPH07114149B2 (en) * 1989-10-30 1995-12-06 ミシガン・ステート・ユニバーシテイ Material processing method and processing equipment
US5525547A (en) * 1992-12-16 1996-06-11 Hitachi, Ltd. Method of fabricating a molded semiconductor device having blocking banks between leads

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5271148A (en) * 1988-11-17 1993-12-21 National Semiconductor Corporation Method of producing a leadframe
JPH07114149B2 (en) * 1989-10-30 1995-12-06 ミシガン・ステート・ユニバーシテイ Material processing method and processing equipment
US5525547A (en) * 1992-12-16 1996-06-11 Hitachi, Ltd. Method of fabricating a molded semiconductor device having blocking banks between leads

Similar Documents

Publication Publication Date Title
JPS56122156A (en) Lead frame for semiconductor device
JPS55162246A (en) Resin-sealed semiconductor device
JPS57173948A (en) Manufacture of semiconductor device
JPS53105175A (en) Lead frame for resin sealing semiconductor device
JPS5776867A (en) Semiconductor device
JPS5372570A (en) Manufacture of semiconductor device
JPS5522889A (en) Manufacturing method of semiconductor device
JPS5710951A (en) Semiconductor device
JPS522282A (en) Semiconductor device
JPS56155557A (en) Semiconductor device
JPS5745957A (en) Circuit substrate and manufacture thereof
JPS54102971A (en) Semiconductor device
JPS522281A (en) Method of making semiconductor devices
JPS5379469A (en) Manufacture of glass mold type semiconductor rectifying device
JPS6428943A (en) Package for semiconductor integrated circuit
JPS54107261A (en) Production of resin seal-type semiconductor device and lead frame used in this production
JPS5779653A (en) Lead frame for resin-sealed semiconductor device
JPS649647A (en) Semiconductor device
JPS5375859A (en) Glass sealing semiconductor
JPS5752155A (en) Manufacture of resin sealed semiconductor device
JPS56115551A (en) Lead frame for semiconductor device
JPS55162247A (en) Composite ic device
JPS6473754A (en) Manufacture of lead frame for semiconductor device
JPS6450453A (en) Glass sealed diode
JPS6484646A (en) Manufacture of semiconductor package