JPS5586135A - Preparation of semiconductor device - Google Patents

Preparation of semiconductor device

Info

Publication number
JPS5586135A
JPS5586135A JP16162678A JP16162678A JPS5586135A JP S5586135 A JPS5586135 A JP S5586135A JP 16162678 A JP16162678 A JP 16162678A JP 16162678 A JP16162678 A JP 16162678A JP S5586135 A JPS5586135 A JP S5586135A
Authority
JP
Japan
Prior art keywords
film
films
jig
chips
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16162678A
Other languages
Japanese (ja)
Other versions
JPS5735583B2 (en
Inventor
Akinori Tanizaki
Noboru Ando
Kunimichi Nakao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP16162678A priority Critical patent/JPS5586135A/en
Publication of JPS5586135A publication Critical patent/JPS5586135A/en
Publication of JPS5735583B2 publication Critical patent/JPS5735583B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Dicing (AREA)

Abstract

PURPOSE: To avoid damaging chips when cracking them, and further, arrange and adhere the cut chips at appropriate intervals on a plastic film.
CONSTITUTION: The surface without scribed grooves 2 of a silicon substrate 1 is adhered to a plastic film 3 and the film is fixed to a cover 4, a film 7 of the same material is fixed to a jig 6 and the cover and the jig with the films are mounted on a pressure reducing jig 11 one over the other. Evacuating air between the films 3 and 7 first from 12 and then introducing air from 10, the two films are vacuum adhered. Next, being placed on a jig 13 with the grooves 2 downwards and pressed with a roller 14, chips 16 are packed between the two films at prescribed intervals without being damaged. Next, they are placed on a vacuum chuck 17 with the cover 4 downwards and after the film 3 is absorbed onto a filter 18, the surface of the film 7 is heated by infrared rays 19, etc., while air is introduced fom 12, then, the film 7 peels off from the surface of the chips 16. Next, the film 3 is removed from the chuck 17. By so constructing, the yield and the reliability of the device are improved and automatic assembly is enabled.
COPYRIGHT: (C)1980,JPO&Japio
JP16162678A 1978-12-23 1978-12-23 Preparation of semiconductor device Granted JPS5586135A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16162678A JPS5586135A (en) 1978-12-23 1978-12-23 Preparation of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16162678A JPS5586135A (en) 1978-12-23 1978-12-23 Preparation of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5586135A true JPS5586135A (en) 1980-06-28
JPS5735583B2 JPS5735583B2 (en) 1982-07-29

Family

ID=15738750

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16162678A Granted JPS5586135A (en) 1978-12-23 1978-12-23 Preparation of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5586135A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50142163A (en) * 1974-05-07 1975-11-15

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50142163A (en) * 1974-05-07 1975-11-15

Also Published As

Publication number Publication date
JPS5735583B2 (en) 1982-07-29

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