JPS5593232A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5593232A
JPS5593232A JP170979A JP170979A JPS5593232A JP S5593232 A JPS5593232 A JP S5593232A JP 170979 A JP170979 A JP 170979A JP 170979 A JP170979 A JP 170979A JP S5593232 A JPS5593232 A JP S5593232A
Authority
JP
Japan
Prior art keywords
electrode
pattern
bonding
mask
dot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP170979A
Other languages
Japanese (ja)
Other versions
JPS5851416B2 (en
Inventor
Masahiro Fukuyama
Chihiro Koike
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP54001709A priority Critical patent/JPS5851416B2/en
Publication of JPS5593232A publication Critical patent/JPS5593232A/en
Publication of JPS5851416B2 publication Critical patent/JPS5851416B2/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To facilitate the positioning of a bonding thin wire to the electrode by installing the dot or line patterns which are contrast with the electrode surface, on the semiconductor pellet electrode surface.
CONSTITUTION: The semiconductor pellet 1 with the electrode 3 surrounded with the oxidized film 4 is fixed on the substrate by means of the solder layer 1 and a metallic thin wire is bound to the bonding position 8 on this electrode 3. At this time, the dot or line white pattern 9, which is contrast with the electrode 3, is installed between the position 8 and the nose 3 of the electrode 3". In this constitution, when the picture taken by the CCD camera is changed to a binary value and scanned by means of the judging mask 6, then, a black pattern spreads around the pattern 9. Every time the mask 6 is replaced by a smaller mask, then, the pattern 9 reduces from 3aW3b and an approximately circular white pattern 3b remains at the position 8. Therefore, when perfoming a bonding making this an aim, an accurate bonding is permitted.
COPYRIGHT: (C)1980,JPO&Japio
JP54001709A 1979-01-09 1979-01-09 Manufacturing method of semiconductor device Expired JPS5851416B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54001709A JPS5851416B2 (en) 1979-01-09 1979-01-09 Manufacturing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54001709A JPS5851416B2 (en) 1979-01-09 1979-01-09 Manufacturing method of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5593232A true JPS5593232A (en) 1980-07-15
JPS5851416B2 JPS5851416B2 (en) 1983-11-16

Family

ID=11509072

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54001709A Expired JPS5851416B2 (en) 1979-01-09 1979-01-09 Manufacturing method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5851416B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5877237A (en) * 1981-11-02 1983-05-10 Hitachi Ltd Bonding device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5877237A (en) * 1981-11-02 1983-05-10 Hitachi Ltd Bonding device

Also Published As

Publication number Publication date
JPS5851416B2 (en) 1983-11-16

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