JPS5595338A - Integrated circuit - Google Patents

Integrated circuit

Info

Publication number
JPS5595338A
JPS5595338A JP241079A JP241079A JPS5595338A JP S5595338 A JPS5595338 A JP S5595338A JP 241079 A JP241079 A JP 241079A JP 241079 A JP241079 A JP 241079A JP S5595338 A JPS5595338 A JP S5595338A
Authority
JP
Japan
Prior art keywords
layer
sio
substrate
lead
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP241079A
Other languages
English (en)
Other versions
JPS5756216B2 (ja
Inventor
Norio Matsui
Taichi Kon
Takaaki Osaki
Norio Nishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NTT Inc
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP241079A priority Critical patent/JPS5595338A/ja
Publication of JPS5595338A publication Critical patent/JPS5595338A/ja
Publication of JPS5756216B2 publication Critical patent/JPS5756216B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP241079A 1979-01-12 1979-01-12 Integrated circuit Granted JPS5595338A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP241079A JPS5595338A (en) 1979-01-12 1979-01-12 Integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP241079A JPS5595338A (en) 1979-01-12 1979-01-12 Integrated circuit

Publications (2)

Publication Number Publication Date
JPS5595338A true JPS5595338A (en) 1980-07-19
JPS5756216B2 JPS5756216B2 (ja) 1982-11-29

Family

ID=11528469

Family Applications (1)

Application Number Title Priority Date Filing Date
JP241079A Granted JPS5595338A (en) 1979-01-12 1979-01-12 Integrated circuit

Country Status (1)

Country Link
JP (1) JPS5595338A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6167936A (ja) * 1984-09-11 1986-04-08 Mitsubishi Electric Corp 半導体装置の製造方法
JPS61292333A (ja) * 1985-06-19 1986-12-23 Sumitomo Electric Ind Ltd 半導体チツプキヤリアの製造方法
JP2002532876A (ja) * 1998-12-07 2002-10-02 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 電子的な構成素子をケーシング封入する方法
JP2007214152A (ja) * 2006-02-07 2007-08-23 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1990001215A1 (fr) * 1988-07-22 1990-02-08 Nippondenso Co., Ltd. Dispositif a semi-conducteurs

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6167936A (ja) * 1984-09-11 1986-04-08 Mitsubishi Electric Corp 半導体装置の製造方法
JPS61292333A (ja) * 1985-06-19 1986-12-23 Sumitomo Electric Ind Ltd 半導体チツプキヤリアの製造方法
JP2002532876A (ja) * 1998-12-07 2002-10-02 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 電子的な構成素子をケーシング封入する方法
JP2007214152A (ja) * 2006-02-07 2007-08-23 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法

Also Published As

Publication number Publication date
JPS5756216B2 (ja) 1982-11-29

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