JPS5598875A - Semiconductor device with photocell - Google Patents
Semiconductor device with photocellInfo
- Publication number
- JPS5598875A JPS5598875A JP617979A JP617979A JPS5598875A JP S5598875 A JPS5598875 A JP S5598875A JP 617979 A JP617979 A JP 617979A JP 617979 A JP617979 A JP 617979A JP S5598875 A JPS5598875 A JP S5598875A
- Authority
- JP
- Japan
- Prior art keywords
- photocell
- film
- cutouts
- except
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Light Receiving Elements (AREA)
Abstract
PURPOSE: To eliminate the adverse affection of light transmission to other element with a simple configuration by selectively coating the portion except a photocell with opaque insulating film.
CONSTITUTION: A photocell 12 is formed on part of a chip 11 on a lead wire 10. An opaque insulating film 13 of polyimide resin containing C or the like is formed at the portion except the portion provided with the photocell 12, and cutouts are formed at predetermined portions of the film 13. After lead wires 14, 15 are connected through the cutouts, parts of the lead wires 10, 16 are exposed and sealed with transparent resin 17. According to this configuration it can completely shield detrimental light except the photocell. In addition, the film 13 may be simply formed in high accuracy.
COPYRIGHT: (C)1980,JPO&Japio
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6179A JPS54116396A (en) | 1978-01-05 | 1979-01-05 | Catalyst activation process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5598875A true JPS5598875A (en) | 1980-07-28 |
Family
ID=11463672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP617979A Pending JPS5598875A (en) | 1979-01-05 | 1979-01-24 | Semiconductor device with photocell |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5598875A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6017952A (en) * | 1983-07-12 | 1985-01-29 | Seiko Epson Corp | Image sensor |
| JPH01164073A (en) * | 1987-09-11 | 1989-06-28 | Canon Inc | Photoelectric conversion device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5041822U (en) * | 1973-08-09 | 1975-04-28 | ||
| JPS50125692A (en) * | 1974-03-20 | 1975-10-02 |
-
1979
- 1979-01-24 JP JP617979A patent/JPS5598875A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5041822U (en) * | 1973-08-09 | 1975-04-28 | ||
| JPS50125692A (en) * | 1974-03-20 | 1975-10-02 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6017952A (en) * | 1983-07-12 | 1985-01-29 | Seiko Epson Corp | Image sensor |
| JPH01164073A (en) * | 1987-09-11 | 1989-06-28 | Canon Inc | Photoelectric conversion device |
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