JPS5599731A - Method of assembling electronic device and lead frame used for assembly - Google Patents

Method of assembling electronic device and lead frame used for assembly

Info

Publication number
JPS5599731A
JPS5599731A JP709679A JP709679A JPS5599731A JP S5599731 A JPS5599731 A JP S5599731A JP 709679 A JP709679 A JP 709679A JP 709679 A JP709679 A JP 709679A JP S5599731 A JPS5599731 A JP S5599731A
Authority
JP
Japan
Prior art keywords
penetrating hole
lead frame
assembly
electronic device
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP709679A
Other languages
Japanese (ja)
Inventor
Tasuku Unno
Masami Kiyono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP709679A priority Critical patent/JPS5599731A/en
Publication of JPS5599731A publication Critical patent/JPS5599731A/en
Pending legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To prevent the short circuit trouble at a semiconductor chip edge caused by effluent solder by forming a penetrating hole at the position of a lead piece joined via the solder layer of a semiconductor chip.
CONSTITUTION: Near the end of the lead piece 21 of a lead frame, a penetrating hole 21a is formed, and putting the part of the penetrating hole on a projected electrode 31 and heating them, they are joined by a solder layer 4. An excess solder layer 4 gathers in the penetrating hole 21a and a trouble that solder flows to the edge part of a semiconductor chip can be avoided.
COPYRIGHT: (C)1980,JPO&Japio
JP709679A 1979-01-26 1979-01-26 Method of assembling electronic device and lead frame used for assembly Pending JPS5599731A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP709679A JPS5599731A (en) 1979-01-26 1979-01-26 Method of assembling electronic device and lead frame used for assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP709679A JPS5599731A (en) 1979-01-26 1979-01-26 Method of assembling electronic device and lead frame used for assembly

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP60212494A Division JPS61116865A (en) 1985-09-27 1985-09-27 Lead frame

Publications (1)

Publication Number Publication Date
JPS5599731A true JPS5599731A (en) 1980-07-30

Family

ID=11656538

Family Applications (1)

Application Number Title Priority Date Filing Date
JP709679A Pending JPS5599731A (en) 1979-01-26 1979-01-26 Method of assembling electronic device and lead frame used for assembly

Country Status (1)

Country Link
JP (1) JPS5599731A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61116865A (en) * 1985-09-27 1986-06-04 Hitachi Ltd Lead frame
JPS6321843A (en) * 1986-07-15 1988-01-29 Toshiba Corp Semiconductor device
JPS63304700A (en) * 1987-06-03 1988-12-12 Nec Corp Method of taping semiconductor device for power
JPH03177033A (en) * 1989-12-05 1991-08-01 Fujitsu Ltd Semiconductor device and manufacture thereof
US5062567A (en) * 1988-12-20 1991-11-05 Schlumberger Technologies, Inc. Lead design to facilitate post-reflow solder joint quality inspection
JPH06151514A (en) * 1992-11-12 1994-05-31 Nec Corp Integrated circuit lead frame

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6029218A (en) * 1983-07-14 1985-02-14 Oyo Jiki Kenkyusho:Kk Wire-cut machining method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6029218A (en) * 1983-07-14 1985-02-14 Oyo Jiki Kenkyusho:Kk Wire-cut machining method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61116865A (en) * 1985-09-27 1986-06-04 Hitachi Ltd Lead frame
JPS6321843A (en) * 1986-07-15 1988-01-29 Toshiba Corp Semiconductor device
JPS63304700A (en) * 1987-06-03 1988-12-12 Nec Corp Method of taping semiconductor device for power
US5062567A (en) * 1988-12-20 1991-11-05 Schlumberger Technologies, Inc. Lead design to facilitate post-reflow solder joint quality inspection
JPH03177033A (en) * 1989-12-05 1991-08-01 Fujitsu Ltd Semiconductor device and manufacture thereof
JPH06151514A (en) * 1992-11-12 1994-05-31 Nec Corp Integrated circuit lead frame

Similar Documents

Publication Publication Date Title
JPS53105970A (en) Assembling method for semiconductor device
JPS5599731A (en) Method of assembling electronic device and lead frame used for assembly
JPS6481330A (en) Film carrier semiconductor device
JPS5545501A (en) Soldering tool
EP0023534A3 (en) Semiconductor device mounting structure and method of mounting
JPS5422162A (en) Manufacture of semiconductor device
JPS51138179A (en) Semi-conductor device
JPS51117574A (en) Semiconductor equipment
JPS5432992A (en) Device and method for manufacturing semiconductor device
JPS5612756A (en) Integrated circuit device
JPS56148840A (en) Mounting structure for ic
JPS5261480A (en) Production of lead frame for ic
JPS54868A (en) Semiconductor device
JPS5379462A (en) Manufacture of semiconductor integrated circuit
JPS5228262A (en) Process for assembling semiconductor device
JPS53141575A (en) Semiconductor device
JPS5434686A (en) Semiconductor device
JPS52115176A (en) Ball soldering method
JPS5368163A (en) Production of flip chip
JPS5411673A (en) Semiconductor chip
JPS5346279A (en) Production of semiconductor device
JPS5222880A (en) Integrated circuit package
JPS5299068A (en) Semiconductor device
JPS5235581A (en) Manufacturing process of semiconductor device
JPS5336185A (en) Electrode lead-out method of semiconductor integrated circuit