JPS56100433A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS56100433A
JPS56100433A JP286780A JP286780A JPS56100433A JP S56100433 A JPS56100433 A JP S56100433A JP 286780 A JP286780 A JP 286780A JP 286780 A JP286780 A JP 286780A JP S56100433 A JPS56100433 A JP S56100433A
Authority
JP
Japan
Prior art keywords
elements
sheet
frame
constitution
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP286780A
Other languages
Japanese (ja)
Inventor
Osamu Usuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP286780A priority Critical patent/JPS56100433A/en
Publication of JPS56100433A publication Critical patent/JPS56100433A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape

Abstract

PURPOSE:To prevent a semiconductor element from being damaged by exfoliating the element from a sheet with a sucking force while vibrating the element in a prescribed direction. CONSTITUTION:Semiconductor elements 10 numbering about 17,000 pieces are stuck to the sheet 11 with bonding strength of 0.5-2g. The sheet being pulled, the interval between elements is made to be about 120mu and the elements are fixed to the opening end of a cylindrical moving frame 12 with a ring 13. The frame 12 is moved by a pulse motor 15, the elements 10 to be taken up are arranged just below a sucking tool 14 and the flat top part of a supporting block 16 is made to contact therewith through the intermediary of the sheet 11. With the tool 14 being lowered to hold the elements 10, the frame 12 is moved slightly so that the sheet 11 moves with the amplitude of 40 approximately, whereby the elements are exfoliated from the surface of the sheet. The operation is repeated sequentially. By this constitution, the time required for operation is shortened, while the elements can be supplied to a prescribed position with no damage thereof.
JP286780A 1980-01-14 1980-01-14 Manufacture of semiconductor device Pending JPS56100433A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP286780A JPS56100433A (en) 1980-01-14 1980-01-14 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP286780A JPS56100433A (en) 1980-01-14 1980-01-14 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS56100433A true JPS56100433A (en) 1981-08-12

Family

ID=11541304

Family Applications (1)

Application Number Title Priority Date Filing Date
JP286780A Pending JPS56100433A (en) 1980-01-14 1980-01-14 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS56100433A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02230754A (en) * 1989-03-03 1990-09-13 Furukawa Electric Co Ltd:The Peeling of thin film chip from adhesive sheet
JPH02246241A (en) * 1989-03-20 1990-10-02 Fujitsu Ltd Manufacture of semiconductor device
KR20040086577A (en) * 2003-03-31 2004-10-11 가부시끼가이샤 르네사스 테크놀로지 Method of mamufacturing a semiconductor device
JP2009117867A (en) * 2009-02-16 2009-05-28 Renesas Technology Corp Manufacturing method of semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02230754A (en) * 1989-03-03 1990-09-13 Furukawa Electric Co Ltd:The Peeling of thin film chip from adhesive sheet
JPH02246241A (en) * 1989-03-20 1990-10-02 Fujitsu Ltd Manufacture of semiconductor device
KR20040086577A (en) * 2003-03-31 2004-10-11 가부시끼가이샤 르네사스 테크놀로지 Method of mamufacturing a semiconductor device
JP2009117867A (en) * 2009-02-16 2009-05-28 Renesas Technology Corp Manufacturing method of semiconductor device

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