JPS56100441A - Semiconductor ic device with protection element and manufacture thereof - Google Patents
Semiconductor ic device with protection element and manufacture thereofInfo
- Publication number
- JPS56100441A JPS56100441A JP262680A JP262680A JPS56100441A JP S56100441 A JPS56100441 A JP S56100441A JP 262680 A JP262680 A JP 262680A JP 262680 A JP262680 A JP 262680A JP S56100441 A JPS56100441 A JP S56100441A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- protection element
- prepared
- film
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
- H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
- H10D89/611—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using diodes as protective elements
Landscapes
- Local Oxidation Of Silicon (AREA)
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
PURPOSE:To obtain a highly-integrated IC with a protection element by providing the protection element in a P type Si substrate, by constituting the P-N junction thereof from the 1st region and the 2nd region deeper than the former, and by connecting an input terminal with the 2nd region through the intermediary of an N type poly-Si layer. CONSTITUTION:A field oxidized film 2 and a gate oxidized film 6 are provided on the P type Si substrate, an opening is made in the film 6, poly-Si 78 is piled, and in a part thereof SiO220 is formed. Next, the resistance of the layer 78 is lowered through P diffusion and N<+> layers 5 and 21 are prepared. The layer 78 and the film 20 are subjected to patterning and gate electrodes 7 and 22, a connection layer 8 of the input terminal with the layer 5, a drain drawing-out layer 23, a resistance layer 24 and a wiring 25 are prepared. Then, the surface of the poly-Si is oxidized thermally and covered with SiO226, while P ions are struck therein, and thereby N<+> layers 4, 3, 27 and 28 are prepared through self-alignment. Being covered with PSG29, Al layers 11 (input terminal), 14, 15 and 31 are prepared selectively. By this constitution, the highly-integrated IC with the protection element A, FETQM as a memory cell and a resistor 24 is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP262680A JPS56100441A (en) | 1980-01-16 | 1980-01-16 | Semiconductor ic device with protection element and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP262680A JPS56100441A (en) | 1980-01-16 | 1980-01-16 | Semiconductor ic device with protection element and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS56100441A true JPS56100441A (en) | 1981-08-12 |
Family
ID=11534598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP262680A Pending JPS56100441A (en) | 1980-01-16 | 1980-01-16 | Semiconductor ic device with protection element and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56100441A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6057659A (en) * | 1983-09-09 | 1985-04-03 | Hitachi Ltd | Semiconductor integrated circuit device |
| JPS6144471A (en) * | 1984-06-06 | 1986-03-04 | テキサス インスツルメンツ インコーポレイテッド | Electrostatic discharge protecting circuit of semiconductor device |
| JPS6173427A (en) * | 1984-09-18 | 1986-04-15 | Matsushita Electric Ind Co Ltd | FM intermediate frequency amplification circuit |
| JPS61283155A (en) * | 1985-06-07 | 1986-12-13 | Mitsubishi Electric Corp | Input protecting circuit of semiconductor device |
| KR100325185B1 (en) * | 1998-06-26 | 2002-02-21 | 가네꼬 히사시 | Semiconductor integrated circuit |
-
1980
- 1980-01-16 JP JP262680A patent/JPS56100441A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6057659A (en) * | 1983-09-09 | 1985-04-03 | Hitachi Ltd | Semiconductor integrated circuit device |
| JPS6144471A (en) * | 1984-06-06 | 1986-03-04 | テキサス インスツルメンツ インコーポレイテッド | Electrostatic discharge protecting circuit of semiconductor device |
| JPH07321318A (en) * | 1984-06-06 | 1995-12-08 | Texas Instr Inc <Ti> | Protection device for semiconductor devices |
| JPS6173427A (en) * | 1984-09-18 | 1986-04-15 | Matsushita Electric Ind Co Ltd | FM intermediate frequency amplification circuit |
| JPS61283155A (en) * | 1985-06-07 | 1986-12-13 | Mitsubishi Electric Corp | Input protecting circuit of semiconductor device |
| KR100325185B1 (en) * | 1998-06-26 | 2002-02-21 | 가네꼬 히사시 | Semiconductor integrated circuit |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS56134757A (en) | Complementary type mos semiconductor device and its manufacture | |
| JPS5477081A (en) | Semiconductor device and production of the same | |
| JPS5696850A (en) | Semiconductor device and manufacture thereof | |
| JPS5756958A (en) | Semiconductor device | |
| JPS5643749A (en) | Semiconductor device and its manufacture | |
| JPS56164578A (en) | Manufacture of mos type semiconductor device | |
| JPS5649570A (en) | Semiconductor memory and its manufacturing process | |
| JPS54159188A (en) | Semiconductor device | |
| JPS54137982A (en) | Semiconductor device and its manufacture | |
| JPS5449082A (en) | Semiconductor device | |
| JPS54154966A (en) | Semiconductor electron device | |
| JPS56125875A (en) | Semiconductor integrated circuit device | |
| JPS5742169A (en) | Production of semiconductor device | |
| JPS5522879A (en) | Insulation gate type field effect semiconductor device | |
| JPS5750451A (en) | Semiconductor | |
| JPS57100755A (en) | Semiconductor device | |
| JPS55125645A (en) | Production of semiconductor device | |
| JPS5522881A (en) | Manufacturing method of semiconductor device | |
| JPS5522885A (en) | Insulation gate type field effect semiconductor device | |
| JPS55110056A (en) | Semiconductor device | |
| JPS55125646A (en) | Semiconductor device | |
| JPS5513953A (en) | Complementary integrated circuit | |
| JPS57115858A (en) | Semiconductor device | |
| JPS577153A (en) | Preparation of semiconductor device | |
| JPS54109794A (en) | Manufacture of semiconductor device |