JPS56107566A - Resin sealing method for semiconductor device - Google Patents

Resin sealing method for semiconductor device

Info

Publication number
JPS56107566A
JPS56107566A JP16961180A JP16961180A JPS56107566A JP S56107566 A JPS56107566 A JP S56107566A JP 16961180 A JP16961180 A JP 16961180A JP 16961180 A JP16961180 A JP 16961180A JP S56107566 A JPS56107566 A JP S56107566A
Authority
JP
Japan
Prior art keywords
tab
lead
semiconductor device
difference
resin sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16961180A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5750067B2 (cs
Inventor
Sadao Ogura
Kazuo Hoya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP16961180A priority Critical patent/JPS56107566A/ja
Publication of JPS56107566A publication Critical patent/JPS56107566A/ja
Publication of JPS5750067B2 publication Critical patent/JPS5750067B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP16961180A 1980-12-03 1980-12-03 Resin sealing method for semiconductor device Granted JPS56107566A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16961180A JPS56107566A (en) 1980-12-03 1980-12-03 Resin sealing method for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16961180A JPS56107566A (en) 1980-12-03 1980-12-03 Resin sealing method for semiconductor device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP49102085A Division JPS5748858B2 (cs) 1974-09-06 1974-09-06

Publications (2)

Publication Number Publication Date
JPS56107566A true JPS56107566A (en) 1981-08-26
JPS5750067B2 JPS5750067B2 (cs) 1982-10-25

Family

ID=15889699

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16961180A Granted JPS56107566A (en) 1980-12-03 1980-12-03 Resin sealing method for semiconductor device

Country Status (1)

Country Link
JP (1) JPS56107566A (cs)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03104873U (cs) * 1990-02-07 1991-10-30
JPH03257377A (ja) * 1990-03-07 1991-11-15 Tokyo Electric Power Co Inc:The 電気接続装置
AU2019286882B2 (en) * 2018-06-13 2023-11-23 Mitsubishi Gas Chemical Company, Inc. LGPS-based solid electrolyte and production method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4964373A (cs) * 1972-06-23 1974-06-21

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4964373A (cs) * 1972-06-23 1974-06-21

Also Published As

Publication number Publication date
JPS5750067B2 (cs) 1982-10-25

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