JPS5615077A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5615077A JPS5615077A JP9055579A JP9055579A JPS5615077A JP S5615077 A JPS5615077 A JP S5615077A JP 9055579 A JP9055579 A JP 9055579A JP 9055579 A JP9055579 A JP 9055579A JP S5615077 A JPS5615077 A JP S5615077A
- Authority
- JP
- Japan
- Prior art keywords
- film
- gate electrode
- silicon dioxide
- opening
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
Landscapes
- Electrodes Of Semiconductors (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
PURPOSE:To form deeply a high density impurity layer in a semiconductor substrate without forming in the bases of source and drain regions by a method wherein an opening to form a gate electrode is prepared on a polycrystalline Si layer using a mask, and an impurity is introduced only to the portion of substrate under the gate. CONSTITUTION:A silicon dioxide film 32 is formed on the surface of a p-type silicon semiconductor substrate 10, a polycrystalline layer 34 is formed on it by vapor growth and a silicon dioxide film 36 and a silicon nitride film 38 are formed on it. An opening is made at the portion of the silicon nitride film 38 to form a gate electrode using photo resists 40. Then a p-type impurity boron B is introduced to a channel region forming part by ion implantation. A silicon dioxide film 36a is formed thickly only at the opening part by thermal oxidation, and etching is performed reaching to the film 36 to remain the thick oxide film 36a as a mask. Finally a gate electrode 16 is formed by etching.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9055579A JPS5615077A (en) | 1979-07-17 | 1979-07-17 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9055579A JPS5615077A (en) | 1979-07-17 | 1979-07-17 | Manufacture of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5615077A true JPS5615077A (en) | 1981-02-13 |
Family
ID=14001647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9055579A Pending JPS5615077A (en) | 1979-07-17 | 1979-07-17 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5615077A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05121737A (en) * | 1991-07-15 | 1993-05-18 | Nec Corp | Manufacture of semiconductor device |
| US5888873A (en) * | 1996-11-06 | 1999-03-30 | Advanced Micro Devices, Inc. | Method of manufacturing short channel MOS devices |
-
1979
- 1979-07-17 JP JP9055579A patent/JPS5615077A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05121737A (en) * | 1991-07-15 | 1993-05-18 | Nec Corp | Manufacture of semiconductor device |
| US5888873A (en) * | 1996-11-06 | 1999-03-30 | Advanced Micro Devices, Inc. | Method of manufacturing short channel MOS devices |
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