JPS564255A - Semiconductor device sealed up with resin - Google Patents

Semiconductor device sealed up with resin

Info

Publication number
JPS564255A
JPS564255A JP7919479A JP7919479A JPS564255A JP S564255 A JPS564255 A JP S564255A JP 7919479 A JP7919479 A JP 7919479A JP 7919479 A JP7919479 A JP 7919479A JP S564255 A JPS564255 A JP S564255A
Authority
JP
Japan
Prior art keywords
lead
projection
resin package
resin
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7919479A
Other languages
Japanese (ja)
Inventor
Koichi Kiyozuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7919479A priority Critical patent/JPS564255A/en
Publication of JPS564255A publication Critical patent/JPS564255A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To avoid strain concentration to the jointed part of a lead and prevent it from becoming defective, by protruding the lower part of the lead fitting portion of a resin package along the bending shape of the lead. CONSTITUTION:A projection 8 is made under the lead fitting portion of a resin package 1. A lead is bent along the projection 8. When the lead is thrusted by an upper mold, stress does not concentrate to the jointed part of the lead because of the projection. At that time, the lead is bent along the corner of the projection. It is effective to slightly round the corner of the projection at R. This results in preventing the cracking of the resin package, the breake of a pin, the cracking of the lead, etc.
JP7919479A 1979-06-25 1979-06-25 Semiconductor device sealed up with resin Pending JPS564255A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7919479A JPS564255A (en) 1979-06-25 1979-06-25 Semiconductor device sealed up with resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7919479A JPS564255A (en) 1979-06-25 1979-06-25 Semiconductor device sealed up with resin

Publications (1)

Publication Number Publication Date
JPS564255A true JPS564255A (en) 1981-01-17

Family

ID=13683158

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7919479A Pending JPS564255A (en) 1979-06-25 1979-06-25 Semiconductor device sealed up with resin

Country Status (1)

Country Link
JP (1) JPS564255A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS607743A (en) * 1983-06-27 1985-01-16 Nec Corp Resin sealed semiconductor device
JPS61196543U (en) * 1985-05-29 1986-12-08
JPH01312859A (en) * 1988-06-10 1989-12-18 Murata Mfg Co Ltd Manufacture of dip type electronic component
JPH0340456A (en) * 1989-07-07 1991-02-21 Matsushita Electron Corp Resin sealed semiconductor device
US5063434A (en) * 1989-09-22 1991-11-05 Kabushiki Kaisha Toshiba Plastic molded type power semiconductor device
JPH056931U (en) * 1991-07-02 1993-01-29 株式会社村田製作所 Surface mount type piezoelectric component
US5656864A (en) * 1993-09-09 1997-08-12 Fujitsu Limited Semiconductor device having upper and lower package bodies and manufacturing method thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4947712A (en) * 1972-05-09 1974-05-09

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4947712A (en) * 1972-05-09 1974-05-09

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS607743A (en) * 1983-06-27 1985-01-16 Nec Corp Resin sealed semiconductor device
JPS61196543U (en) * 1985-05-29 1986-12-08
JPH01312859A (en) * 1988-06-10 1989-12-18 Murata Mfg Co Ltd Manufacture of dip type electronic component
JPH0340456A (en) * 1989-07-07 1991-02-21 Matsushita Electron Corp Resin sealed semiconductor device
US5063434A (en) * 1989-09-22 1991-11-05 Kabushiki Kaisha Toshiba Plastic molded type power semiconductor device
JPH056931U (en) * 1991-07-02 1993-01-29 株式会社村田製作所 Surface mount type piezoelectric component
US5656864A (en) * 1993-09-09 1997-08-12 Fujitsu Limited Semiconductor device having upper and lower package bodies and manufacturing method thereof

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