JPS5648155A - Package forming method for semiconductor - Google Patents

Package forming method for semiconductor

Info

Publication number
JPS5648155A
JPS5648155A JP12611479A JP12611479A JPS5648155A JP S5648155 A JPS5648155 A JP S5648155A JP 12611479 A JP12611479 A JP 12611479A JP 12611479 A JP12611479 A JP 12611479A JP S5648155 A JPS5648155 A JP S5648155A
Authority
JP
Japan
Prior art keywords
molds
joining
press
lead frame
impressions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12611479A
Other languages
Japanese (ja)
Other versions
JPS6119117B2 (en
Inventor
Keiji Hazama
Mitsuyoshi Nakatsuka
Shinichi Oota
Fumio Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP12611479A priority Critical patent/JPS5648155A/en
Publication of JPS5648155A publication Critical patent/JPS5648155A/en
Publication of JPS6119117B2 publication Critical patent/JPS6119117B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent flash generation by heating and joining two thermoplastic resin moldings having hollow parts to receive a semiconductor and the joining faces of required outlines from both sides of a lead frame with molds having required depth impressions and at the same time pressing the moldings with separate press- joiners. CONSTITUTION:Joining molds 10 and 10' having impressions 12 with openings of the same forms as the outline 9 of the cross-section of a resin molding and a depth including a melt-joining portion 2 are prepared. Resin moldings 3 and 3' are put into the impressions of the molds 10 and 10' and their melt-joining portions 2 and 2' are softened and melted being given heat energy from an optional heating means, then sandwiching a lead frame 4 with the molds 10 and 10' and pressing with press- joiners 13 and 13' independent from the molds 10 and 10', the resin moldings are press-joined to both sides of the lead frame. By so constructing, resin flows into pools 15 formed by the faces 11 and 11' of the molds and the dams 14 of the lead frame, but on the front and back faces of the lead which are press-joined with the molds, detrimental flashes are not formed.
JP12611479A 1979-09-27 1979-09-27 Package forming method for semiconductor Granted JPS5648155A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12611479A JPS5648155A (en) 1979-09-27 1979-09-27 Package forming method for semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12611479A JPS5648155A (en) 1979-09-27 1979-09-27 Package forming method for semiconductor

Publications (2)

Publication Number Publication Date
JPS5648155A true JPS5648155A (en) 1981-05-01
JPS6119117B2 JPS6119117B2 (en) 1986-05-15

Family

ID=14926974

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12611479A Granted JPS5648155A (en) 1979-09-27 1979-09-27 Package forming method for semiconductor

Country Status (1)

Country Link
JP (1) JPS5648155A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5919359A (en) * 1982-07-23 1984-01-31 Hitachi Chem Co Ltd Forming method for package of semiconductors
JPS62224949A (en) * 1986-03-27 1987-10-02 S M C:Kk Ic package
US5298464A (en) * 1989-10-26 1994-03-29 Digital Equipment Corporation Method of mounting a tape automated bonded semiconductor in a housing using a compressor
JPH06252283A (en) * 1993-02-24 1994-09-09 Kyocera Corp Semiconductor device
US6696752B2 (en) * 2000-05-22 2004-02-24 Siliconware Precision Industries Co., Ltd. Encapsulated semiconductor device with flash-proof structure
US7170158B2 (en) * 2001-06-29 2007-01-30 Samsung Electronics Co., Ltd. Double-sided circuit board and multi-chip package including such a circuit board and method for manufacture

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5919359A (en) * 1982-07-23 1984-01-31 Hitachi Chem Co Ltd Forming method for package of semiconductors
JPS62224949A (en) * 1986-03-27 1987-10-02 S M C:Kk Ic package
US5298464A (en) * 1989-10-26 1994-03-29 Digital Equipment Corporation Method of mounting a tape automated bonded semiconductor in a housing using a compressor
JPH06252283A (en) * 1993-02-24 1994-09-09 Kyocera Corp Semiconductor device
US6696752B2 (en) * 2000-05-22 2004-02-24 Siliconware Precision Industries Co., Ltd. Encapsulated semiconductor device with flash-proof structure
US7170158B2 (en) * 2001-06-29 2007-01-30 Samsung Electronics Co., Ltd. Double-sided circuit board and multi-chip package including such a circuit board and method for manufacture

Also Published As

Publication number Publication date
JPS6119117B2 (en) 1986-05-15

Similar Documents

Publication Publication Date Title
ATE6605T1 (en) DEVICE FOR THE MANUFACTURE OF PLASTIC PIPES WITH TRANSVERSAL GROOVES.
JPS5770627A (en) Manufacture of ventilator
DE3772503D1 (en) METHOD FOR PRODUCING AN INJECTION MOLDING TOOL.
JPS55139217A (en) Method and apparatus for welding hollow thermoplastic resin material in hot air
SE7910495L (en) METHOD AND APPLIANCES FOR MANUFACTURING WALLS OF METAL COMPOSITION MATERIAL THROUGH UNIFIED POSITION
DE3473589D1 (en) Method for producing a permanent connection of the ends of at least two already finished metal tubes, particularly for the manufacture of a bicycle frame and a frame thus manufactured
JPS56118816A (en) Manufacture of molded laminate for automobile ceiling
JPS5794706A (en) Plate-like lens
JPS57100032A (en) Method and apparatus for manufacturing thermoplastic resin sheet like object
JPS55122648A (en) Bonding method of extinctable split patterns
JPS53134881A (en) Method of welding thermoplastic resin material
JPS5649211A (en) Manufacturing of dress and skins of doll
JPS5369581A (en) Manufacture for resin sealed type semiconductor device
JPS578138A (en) Mold for resin sealing
JPS6444026A (en) Resin-seal formation of component to be sealed and heat resistant sheet member used therefor
JPS574722A (en) Molding method of plastic and metal in one body
JPS56162622A (en) Foamed molding method
JPS5791887A (en) Formation of projection for resistance welding
JPS5684927A (en) Manufacture of composite cellular molding
JPS5597940A (en) Molding method of and apparatus for linked molding
JPS5680433A (en) Foamed forming method
FR2564375B1 (en) PROCESS FOR THE MANUFACTURE OF LIGHTWEIGHT, RIGID TUBES IN THERMOPLASTIC MATERIAL
JPS5686649A (en) Production of mold for precision casting
JPS57157716A (en) Fusion-bonding method for plate shaped body of synthetic resin
JPS5597937A (en) Gluing of breathable and decorative laminated sheet