JPS5656666A - Mos integrated circuit device and preparation thereof - Google Patents
Mos integrated circuit device and preparation thereofInfo
- Publication number
- JPS5656666A JPS5656666A JP13389979A JP13389979A JPS5656666A JP S5656666 A JPS5656666 A JP S5656666A JP 13389979 A JP13389979 A JP 13389979A JP 13389979 A JP13389979 A JP 13389979A JP S5656666 A JPS5656666 A JP S5656666A
- Authority
- JP
- Japan
- Prior art keywords
- gate
- fet
- threshold voltage
- width
- fets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
Landscapes
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
PURPOSE:To reduce a leak current throughout the device by a method wherein the threshold voltage of MOSFETs is leveled approximately and thereby the tailing properties which the FET with a large gate width usually has are made excellent in the MOSIC wherein the FETs having large or small gate width respectively are mixed. CONSTITUTION:A source region 1 having source electrodes 4 on both sides of a gate region 3 provided with a gate electrode 6 and a drain region 2 having a drain electrode 5 are arranged to compose an FET. Next, two FETs are formed on the same semiconductor substrate to compose an MOSIC. On the occasion, when there is any difference in the gate width W of the FETs, the tailing phenomenon wherein the drain current changes logarithmically in relation to the gate voltage at the threshold voltage or below is caused in the FET which has a large width. In order to eliminate this phenomenon, an ion is injected into the FET having a large W/L ratio, where L is the length of the gate and W is the width of the gate, so as to raise the threshold voltage. Thus, the threshold voltage of two FET is leveled approximately, whereby the increase in the leak current is prevented.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13389979A JPS5656666A (en) | 1979-10-13 | 1979-10-13 | Mos integrated circuit device and preparation thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13389979A JPS5656666A (en) | 1979-10-13 | 1979-10-13 | Mos integrated circuit device and preparation thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5656666A true JPS5656666A (en) | 1981-05-18 |
Family
ID=15115700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13389979A Pending JPS5656666A (en) | 1979-10-13 | 1979-10-13 | Mos integrated circuit device and preparation thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5656666A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4989061A (en) * | 1986-09-05 | 1991-01-29 | General Electric Company | Radiation hard memory cell structure with drain shielding |
-
1979
- 1979-10-13 JP JP13389979A patent/JPS5656666A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4989061A (en) * | 1986-09-05 | 1991-01-29 | General Electric Company | Radiation hard memory cell structure with drain shielding |
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