JPS5660061A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5660061A JPS5660061A JP13577579A JP13577579A JPS5660061A JP S5660061 A JPS5660061 A JP S5660061A JP 13577579 A JP13577579 A JP 13577579A JP 13577579 A JP13577579 A JP 13577579A JP S5660061 A JPS5660061 A JP S5660061A
- Authority
- JP
- Japan
- Prior art keywords
- channel
- field effect
- monocrystalline substrate
- effect transistor
- silicon monocrystalline
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/40—Crystalline structures
- H10D62/405—Orientations of crystalline planes
Landscapes
- Bipolar Transistors (AREA)
Abstract
PURPOSE:To minimize the change in the transistor characteristics due to piezo effect by coinciding the channel direction of a P type channel field effect transistor with <100> direction. CONSTITUTION:The channel of the P type channel field effect transistor formed on the main surface of a silicon monocrystalline substrate 1 is directed in <100> direction. Source 3, gate electrode 5 and drain 4 are so disposed, for example, in a <100> direction being 45 deg. with respect to the orientation flat part 2 in a 100 direction of the silicon monocrystalline substrate 1 having (100) plane so that the channel direction coincides with the <100> direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13577579A JPS5660061A (en) | 1979-10-19 | 1979-10-19 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13577579A JPS5660061A (en) | 1979-10-19 | 1979-10-19 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5660061A true JPS5660061A (en) | 1981-05-23 |
Family
ID=15159558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13577579A Pending JPS5660061A (en) | 1979-10-19 | 1979-10-19 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5660061A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60253268A (en) * | 1984-05-29 | 1985-12-13 | Meidensha Electric Mfg Co Ltd | semiconductor equipment |
| US4662059A (en) * | 1985-09-19 | 1987-05-05 | Rca Corporation | Method of making stabilized silicon-on-insulator field-effect transistors having 100 oriented side and top surfaces |
| FR2815772A1 (en) * | 2000-10-25 | 2002-04-26 | Mitsubishi Electric Corp | SEMICONDUCTOR SLICE, MANUFACTURING PROCESS AND MANUFACTURING APPARATUS |
| US6897526B1 (en) * | 1998-02-12 | 2005-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and process for producing the same |
| US7291542B2 (en) | 2002-09-30 | 2007-11-06 | Renesas Technology Corp. | Semiconductor wafer and manufacturing method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53129987A (en) * | 1977-04-19 | 1978-11-13 | Japan Radio Co Ltd | Semiconductor |
-
1979
- 1979-10-19 JP JP13577579A patent/JPS5660061A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53129987A (en) * | 1977-04-19 | 1978-11-13 | Japan Radio Co Ltd | Semiconductor |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60253268A (en) * | 1984-05-29 | 1985-12-13 | Meidensha Electric Mfg Co Ltd | semiconductor equipment |
| US4662059A (en) * | 1985-09-19 | 1987-05-05 | Rca Corporation | Method of making stabilized silicon-on-insulator field-effect transistors having 100 oriented side and top surfaces |
| US6897526B1 (en) * | 1998-02-12 | 2005-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and process for producing the same |
| US7687855B2 (en) | 1998-02-12 | 2010-03-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having impurity region |
| FR2815772A1 (en) * | 2000-10-25 | 2002-04-26 | Mitsubishi Electric Corp | SEMICONDUCTOR SLICE, MANUFACTURING PROCESS AND MANUFACTURING APPARATUS |
| US6864534B2 (en) | 2000-10-25 | 2005-03-08 | Renesas Technology Corp. | Semiconductor wafer |
| US7291542B2 (en) | 2002-09-30 | 2007-11-06 | Renesas Technology Corp. | Semiconductor wafer and manufacturing method thereof |
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