JPS5687331A - Reducing furnace for solder-treatment - Google Patents

Reducing furnace for solder-treatment

Info

Publication number
JPS5687331A
JPS5687331A JP16348679A JP16348679A JPS5687331A JP S5687331 A JPS5687331 A JP S5687331A JP 16348679 A JP16348679 A JP 16348679A JP 16348679 A JP16348679 A JP 16348679A JP S5687331 A JPS5687331 A JP S5687331A
Authority
JP
Japan
Prior art keywords
furnace
gas
ejected
reduced gas
reduced
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16348679A
Other languages
English (en)
Inventor
Shozo Nemoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP16348679A priority Critical patent/JPS5687331A/ja
Publication of JPS5687331A publication Critical patent/JPS5687331A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy

Landscapes

  • Die Bonding (AREA)
JP16348679A 1979-12-18 1979-12-18 Reducing furnace for solder-treatment Pending JPS5687331A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16348679A JPS5687331A (en) 1979-12-18 1979-12-18 Reducing furnace for solder-treatment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16348679A JPS5687331A (en) 1979-12-18 1979-12-18 Reducing furnace for solder-treatment

Publications (1)

Publication Number Publication Date
JPS5687331A true JPS5687331A (en) 1981-07-15

Family

ID=15774775

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16348679A Pending JPS5687331A (en) 1979-12-18 1979-12-18 Reducing furnace for solder-treatment

Country Status (1)

Country Link
JP (1) JPS5687331A (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5866338A (ja) * 1981-10-15 1983-04-20 Toshiba Corp 半導体マウント装置
JPS5990936A (ja) * 1982-10-08 1984-05-25 ウエスターン　エレクトリック　カムパニー，インコーポレーテッド 超小形電子チツプのボンデイング方法
JPS59182532A (ja) * 1983-04-01 1984-10-17 Shinkawa Ltd ボンデイング装置用加熱装置
JPS6037737A (ja) * 1983-08-11 1985-02-27 Toshiba Corp ペレツトマウント装置
JPS63239957A (ja) * 1987-03-27 1988-10-05 Nec Corp 半導体装置製造方法
US5647740A (en) * 1993-11-08 1997-07-15 Kabushiki Kaisha Shinkawa Lead frame baking oven

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5866338A (ja) * 1981-10-15 1983-04-20 Toshiba Corp 半導体マウント装置
JPS5990936A (ja) * 1982-10-08 1984-05-25 ウエスターン　エレクトリック　カムパニー，インコーポレーテッド 超小形電子チツプのボンデイング方法
JPS59182532A (ja) * 1983-04-01 1984-10-17 Shinkawa Ltd ボンデイング装置用加熱装置
JPS6037737A (ja) * 1983-08-11 1985-02-27 Toshiba Corp ペレツトマウント装置
JPS63239957A (ja) * 1987-03-27 1988-10-05 Nec Corp 半導体装置製造方法
US5647740A (en) * 1993-11-08 1997-07-15 Kabushiki Kaisha Shinkawa Lead frame baking oven

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