JPS5687337A - Wire bonding device - Google Patents

Wire bonding device

Info

Publication number
JPS5687337A
JPS5687337A JP16526279A JP16526279A JPS5687337A JP S5687337 A JPS5687337 A JP S5687337A JP 16526279 A JP16526279 A JP 16526279A JP 16526279 A JP16526279 A JP 16526279A JP S5687337 A JPS5687337 A JP S5687337A
Authority
JP
Japan
Prior art keywords
bonding
arm
antivibration
wire
planes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16526279A
Other languages
Japanese (ja)
Other versions
JPS6031101B2 (en
Inventor
Yasunobu Suzuki
Yuichi Hasegawa
Sakio Anazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Fujitsu Ltd
Original Assignee
Shinkawa Ltd
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Fujitsu Ltd filed Critical Shinkawa Ltd
Priority to JP54165262A priority Critical patent/JPS6031101B2/en
Publication of JPS5687337A publication Critical patent/JPS5687337A/en
Publication of JPS6031101B2 publication Critical patent/JPS6031101B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To stabilize a wire connection by a method wherein there are provided an antivibration mechanism in which an arm is energized before a wire comes in contact with a plane and after a tool separates from a plane, a driving mechanism is vertically moved accompanying a fall between the two planes connected with each other. CONSTITUTION:A tool 2 fixed at a pointed end of a bonding arm 1 makes connection with a wire 3 between the two bonding planes different in height from each other. At this time, the antivibration mechanism 52 energizing the arm just before and just after the wire bonding being carried out is provided, and which is provided with, for example, a holding shaft 54 pressing-down an antivibration holder 55, an antivibration spring 56 energizing the holding shaft and a nut 57 available as a stopper. The antivibration mechanism 52 is driven by a drive arm 50 according to the height between the planes. Whereby the vibrations of the arm produced just before and just after the bonding can be prevented, so that the always stabilized bonding can be accomplished.
JP54165262A 1979-12-18 1979-12-18 wire bonding equipment Expired JPS6031101B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54165262A JPS6031101B2 (en) 1979-12-18 1979-12-18 wire bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54165262A JPS6031101B2 (en) 1979-12-18 1979-12-18 wire bonding equipment

Publications (2)

Publication Number Publication Date
JPS5687337A true JPS5687337A (en) 1981-07-15
JPS6031101B2 JPS6031101B2 (en) 1985-07-20

Family

ID=15808979

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54165262A Expired JPS6031101B2 (en) 1979-12-18 1979-12-18 wire bonding equipment

Country Status (1)

Country Link
JP (1) JPS6031101B2 (en)

Also Published As

Publication number Publication date
JPS6031101B2 (en) 1985-07-20

Similar Documents

Publication Publication Date Title
CN105058212B (en) A kind of valve end cuts fine grinding device
JPS6467611A (en) Robot controller
JPS5687337A (en) Wire bonding device
GB717874A (en) Improvements in and relating to methods of and apparatus for cutting crystal
JPS57144641A (en) Machine tool
JPS57127638A (en) Work positioning and clamping method
JPS56139835A (en) Electrospark machining apparatus
JPS57159034A (en) Wire clamping device
CN223066965U (en) Encapsulation equipment for iron core production
JPS55159985A (en) Recording device
JPS56100433A (en) Manufacture of semiconductor device
JPS55111218A (en) Automatic molding withdrawing apparatus
JPS6451245A (en) Cam mechanism for tool changer
JPS60201822A (en) Automatic demounting apparatus for punched-out part in wire-cut electric discharge machining apparatus
JPS6451201A (en) Working method for twisting and its device
JPS57206041A (en) Cam following device in bonding device
JPS6411728A (en) Wire electrode supply device for wire cut electric discharge machine
JPS6411730A (en) Wire electrode guide device for wire electric discharge machine
JPS57211740A (en) Wire bonder
JPS5637640A (en) Method and apparatus for wire bonding
JPS6415941A (en) Wire bonder
JPS5513908A (en) Wire bonding machine for semiconductor device
SE8302613D0 (en) PROCEDURE AND DEVICE FOR MANUFACTURING THE ELECTRODES OF ROBOTBURNA WELDING RODS
KR200262737Y1 (en) cutting apparatus
ES8107095A1 (en) Articulated Support for Motor Vehicle Sunshields and its Method of Manufacture