JPS5687337A - Wire bonding device - Google Patents

Wire bonding device

Info

Publication number
JPS5687337A
JPS5687337A JP16526279A JP16526279A JPS5687337A JP S5687337 A JPS5687337 A JP S5687337A JP 16526279 A JP16526279 A JP 16526279A JP 16526279 A JP16526279 A JP 16526279A JP S5687337 A JPS5687337 A JP S5687337A
Authority
JP
Japan
Prior art keywords
bonding
arm
antivibration
wire
planes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16526279A
Other languages
English (en)
Other versions
JPS6031101B2 (ja
Inventor
Yasunobu Suzuki
Yuichi Hasegawa
Sakio Anazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Fujitsu Ltd
Original Assignee
Shinkawa Ltd
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Fujitsu Ltd filed Critical Shinkawa Ltd
Priority to JP54165262A priority Critical patent/JPS6031101B2/ja
Publication of JPS5687337A publication Critical patent/JPS5687337A/ja
Publication of JPS6031101B2 publication Critical patent/JPS6031101B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Wire Bonding (AREA)
JP54165262A 1979-12-18 1979-12-18 ワイヤボンデイング装置 Expired JPS6031101B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54165262A JPS6031101B2 (ja) 1979-12-18 1979-12-18 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54165262A JPS6031101B2 (ja) 1979-12-18 1979-12-18 ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS5687337A true JPS5687337A (en) 1981-07-15
JPS6031101B2 JPS6031101B2 (ja) 1985-07-20

Family

ID=15808979

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54165262A Expired JPS6031101B2 (ja) 1979-12-18 1979-12-18 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS6031101B2 (ja)

Also Published As

Publication number Publication date
JPS6031101B2 (ja) 1985-07-20

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