JPS5710256A - Resin composition for sealing semiconductor - Google Patents

Resin composition for sealing semiconductor

Info

Publication number
JPS5710256A
JPS5710256A JP8445080A JP8445080A JPS5710256A JP S5710256 A JPS5710256 A JP S5710256A JP 8445080 A JP8445080 A JP 8445080A JP 8445080 A JP8445080 A JP 8445080A JP S5710256 A JPS5710256 A JP S5710256A
Authority
JP
Japan
Prior art keywords
resin
releasing agent
mold releasing
resin composition
silicone resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8445080A
Other languages
Japanese (ja)
Inventor
Kazuyuki Miki
Takahiro Yoshioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP8445080A priority Critical patent/JPS5710256A/en
Publication of JPS5710256A publication Critical patent/JPS5710256A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/137—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To improve adhesion of a molding body in an element whose surface is covered by silicone resin by blending a specified amount of metallic salt of fatty acid containing a specified amount of metal as a mold releasing agent in the resin composition used for a low pressure molding method. CONSTITUTION:An element such as, e.g., a mesa type diode, photocoupler, and the like, wherein the surface of a chip 2 is covered by silicone resin 3 is sealed and molded by, e.g., epoxy resin 4 by the low pressure molding method. In the resin composition used for sealing material, are blended organic additive, inorganic filling agent, mold releasing agent, and the like, in addition to the resin component containing hardner. As the mold releasing agent, e.g., 0.5-1.5wt% of zinc stearate including 0.1-0.25wt% of metal component is blended and used with respect to the organic component of the composition. In this constitution, adhesion at the boundary between the silicone resin 3 and the sealing part 4 can be improved, and the moisture resistance of the sealed part can be improved.
JP8445080A 1980-06-21 1980-06-21 Resin composition for sealing semiconductor Pending JPS5710256A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8445080A JPS5710256A (en) 1980-06-21 1980-06-21 Resin composition for sealing semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8445080A JPS5710256A (en) 1980-06-21 1980-06-21 Resin composition for sealing semiconductor

Publications (1)

Publication Number Publication Date
JPS5710256A true JPS5710256A (en) 1982-01-19

Family

ID=13830945

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8445080A Pending JPS5710256A (en) 1980-06-21 1980-06-21 Resin composition for sealing semiconductor

Country Status (1)

Country Link
JP (1) JPS5710256A (en)

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